Letter From the EditorsSource: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003::page 30201DOI: 10.1115/1.4028063Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to significantly reduce the time to publication. We were able to increase the impact factor, and we were able to reduce the acceptance rate to below 50%. We have also established an annual Best Paper of the Year Award, Best AE of the Year Award, and Best Reviewer(s) of the Year Award. We have started a series of special issues which highlight areas of general interest to the technical community, and we endeavored to select topics that are current, interesting, and likely to attract readership, subscriptions, and contributions.
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| contributor author | Sammakia, Bahgat G. | |
| contributor author | Lee, Y. C. | |
| date accessioned | 2017-05-09T01:06:49Z | |
| date available | 2017-05-09T01:06:49Z | |
| date issued | 2014 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_136_03_030201.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154471 | |
| description abstract | During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to significantly reduce the time to publication. We were able to increase the impact factor, and we were able to reduce the acceptance rate to below 50%. We have also established an annual Best Paper of the Year Award, Best AE of the Year Award, and Best Reviewer(s) of the Year Award. We have started a series of special issues which highlight areas of general interest to the technical community, and we endeavored to select topics that are current, interesting, and likely to attract readership, subscriptions, and contributions. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Letter From the Editors | |
| type | Journal Paper | |
| journal volume | 136 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4028063 | |
| journal fristpage | 30201 | |
| journal lastpage | 30201 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003 | |
| contenttype | Fulltext |