YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Thermal Aware Microchannel Cooling of Multicore Processors: A Three Stage Design Approach

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002::page 21002
    Author:
    Li, Yubai
    ,
    Guo, Dongzhi
    ,
    Yao, Shi
    DOI: 10.1115/1.4027174
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study goes beyond the common microchannel cooling system composed of uniform parallel straight microchannels and proposed a threestage design approach for spatially thermalaware microchannel cooling of 2D multicore processors. By applying effective strategies and arranging key design parameters, stronger cooling is provided under the high power core area, and less cooling is provided under the low power cache area to effectively save the precious pumping power, lower the hot spot temperature and lower temperature gradients on chip. Two microchannel cooling systems are specifically designed for a 2 core 150 W Intel Tulsa processor and an 8 core 260 W (doubled power) Intel Nehalem processor with single phase HFE7100 as coolant. For the Tulsa processor, a strategy named stripandzone is used. The final design leads to 30 kPa pressure drop and 0.094 W pumping power while maintains the hot spot temperature to be 75آ°C. For the Nehalem processor, a split flow microchannel system and a wideninflow strategy are applied. A design is achieved to cost 15 kPa pressure drop and 0.0845 W pumping power while maintains the hot spot temperature to be 82.9آ°C. The design approach in this study provides the basic guide for the industrial applications of effective multicore processor cooling using microchannels.
    • Download: (3.444Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Thermal Aware Microchannel Cooling of Multicore Processors: A Three Stage Design Approach

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/154460
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorLi, Yubai
    contributor authorGuo, Dongzhi
    contributor authorYao, Shi
    date accessioned2017-05-09T01:06:47Z
    date available2017-05-09T01:06:47Z
    date issued2014
    identifier issn1528-9044
    identifier otherep_136_02_021002.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154460
    description abstractThis study goes beyond the common microchannel cooling system composed of uniform parallel straight microchannels and proposed a threestage design approach for spatially thermalaware microchannel cooling of 2D multicore processors. By applying effective strategies and arranging key design parameters, stronger cooling is provided under the high power core area, and less cooling is provided under the low power cache area to effectively save the precious pumping power, lower the hot spot temperature and lower temperature gradients on chip. Two microchannel cooling systems are specifically designed for a 2 core 150 W Intel Tulsa processor and an 8 core 260 W (doubled power) Intel Nehalem processor with single phase HFE7100 as coolant. For the Tulsa processor, a strategy named stripandzone is used. The final design leads to 30 kPa pressure drop and 0.094 W pumping power while maintains the hot spot temperature to be 75آ°C. For the Nehalem processor, a split flow microchannel system and a wideninflow strategy are applied. A design is achieved to cost 15 kPa pressure drop and 0.0845 W pumping power while maintains the hot spot temperature to be 82.9آ°C. The design approach in this study provides the basic guide for the industrial applications of effective multicore processor cooling using microchannels.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Aware Microchannel Cooling of Multicore Processors: A Three Stage Design Approach
    typeJournal Paper
    journal volume136
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4027174
    journal fristpage21002
    journal lastpage21002
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian