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    A Stepped Bar Apparatus for Thermal Resistance Measurements

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004::page 41002
    Author:
    Thompson, Dakotah R.
    ,
    Rao, Sameer R.
    ,
    Cola, Baratunde A.
    DOI: 10.1115/1.4025116
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A steppedbar apparatus has been designed and constructed to characterize the thermal resistance of materials using steadystate heat transfer techniques. The design of the apparatus is a modification of the ASTM D5470 standard where reference bars of equal crosssectional area are used to extrapolate surface temperatures and heat flux across a sample of unknown thermal resistance. The design modification involves intentionally oversizing the upper reference bar (URB) of the apparatus to avoid contact area uncertainty due to reference bar misalignment, which is difficult to account for, as well as the high cost that can be associated with equipping the apparatus with precise alignment controls (e.g., pneumatic alignment). Multidimensional heat transfer in the upper reference bar near the sample interface is anticipated using numerical modeling. The resulting nonlinear temperature profile in the upper reference bar is accounted for by fitting a second order regression line through thermocouple readings near the sample interface. The thermal resistances of commercially available thermal gap pads and thermal pastes were measured with the steppedbar apparatus; the measured values were in good agreement with published results, and exhibited a high degree of reproducibility. The measurement uncertainty of both the standard and steppedbar apparatus decrease with increased thermocouple precision. Notably, the uncertainty due to reference bar misalignment with the standard apparatus becomes more pronounced as thermocouple precision and the number of thermocouples increases, which suggests that the steppedbar apparatus would be especially advantageous for enabling accurate, highprecision measurements of very low thermal resistances.
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      A Stepped Bar Apparatus for Thermal Resistance Measurements

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    http://yetl.yabesh.ir/yetl1/handle/yetl/151441
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    contributor authorThompson, Dakotah R.
    contributor authorRao, Sameer R.
    contributor authorCola, Baratunde A.
    date accessioned2017-05-09T00:57:44Z
    date available2017-05-09T00:57:44Z
    date issued2013
    identifier issn1528-9044
    identifier otherep_135_04_041002.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151441
    description abstractA steppedbar apparatus has been designed and constructed to characterize the thermal resistance of materials using steadystate heat transfer techniques. The design of the apparatus is a modification of the ASTM D5470 standard where reference bars of equal crosssectional area are used to extrapolate surface temperatures and heat flux across a sample of unknown thermal resistance. The design modification involves intentionally oversizing the upper reference bar (URB) of the apparatus to avoid contact area uncertainty due to reference bar misalignment, which is difficult to account for, as well as the high cost that can be associated with equipping the apparatus with precise alignment controls (e.g., pneumatic alignment). Multidimensional heat transfer in the upper reference bar near the sample interface is anticipated using numerical modeling. The resulting nonlinear temperature profile in the upper reference bar is accounted for by fitting a second order regression line through thermocouple readings near the sample interface. The thermal resistances of commercially available thermal gap pads and thermal pastes were measured with the steppedbar apparatus; the measured values were in good agreement with published results, and exhibited a high degree of reproducibility. The measurement uncertainty of both the standard and steppedbar apparatus decrease with increased thermocouple precision. Notably, the uncertainty due to reference bar misalignment with the standard apparatus becomes more pronounced as thermocouple precision and the number of thermocouples increases, which suggests that the steppedbar apparatus would be especially advantageous for enabling accurate, highprecision measurements of very low thermal resistances.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Stepped Bar Apparatus for Thermal Resistance Measurements
    typeJournal Paper
    journal volume135
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4025116
    journal fristpage41002
    journal lastpage41002
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian