| contributor author | Demetriou, Dustin W. | |
| contributor author | Ezzat Khalifa, H. | |
| date accessioned | 2017-05-09T00:57:42Z | |
| date available | 2017-05-09T00:57:42Z | |
| date issued | 2013 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_135_03_030906.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/151428 | |
| description abstract | This paper introduces a methodology for developing a reduced order model, using proper orthogonal decomposition (POD), to predict the IT rack's inlet temperature distribution within a raised floor aircooled data center. The method used in this paper uses a limited set of computational fluid dynamics data at different useful IT levels and tile airflow fractions. The model was able to reconstruct these datasets to with 0.16 آ°C rms error and interpolate successfully for alternative configurations that were not included in the original dataset. The reduced order model can produce the temperature distribution in the data center in a fraction of a second on a standard personal computer. Several practical IT load placement options in openaisle, aircooled data centers, based on either geometrical traits of the data center, a prior physicsbased knowledge of the airflow and temperature patterns or measurements that are easily obtainable during operation, are considered. The outcome of this work is the development of a robust set of guidelines that facilitate the energy efficient placement of the IT load amongst the operating servers in the data center. This work found that a robust approach was to use realtime temperature measurements at the inlet of the racks to remove the unnecessary IT load from the servers with the warmest inlet temperature. This strategy shows superior performance to the other strategies studied. The study considered the holistic optimization of the data center and cooling infrastructure for a range of data center IT utilization levels. The results showed that allowing for significant reductions in the supply air flow rate proved superior to providing a higher supply air temperature to meet the IT equipment's inlet air temperature constraint. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermally Aware, Energy Based Load Placement in Open Aisle, Air Cooled Data Centers | |
| type | Journal Paper | |
| journal volume | 135 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4024946 | |
| journal fristpage | 30906 | |
| journal lastpage | 30906 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003 | |
| contenttype | Fulltext | |