contributor author | B. Fiedler | |
contributor author | K. Kao | |
contributor author | L. Keer | |
contributor author | M. Fine | |
date accessioned | 2017-05-09T00:49:25Z | |
date available | 2017-05-09T00:49:25Z | |
date copyright | September, 2012 | |
date issued | 2012 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-926029#031006_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/148576 | |
description abstract | In displacement controlled mechanical fatigue of ball grid solder interconnect arrays, decrease in maximum load monitors total increase in crack area in an array while electrical resistance monitors only the area of large cracks that lead to electrical failure. Small cracks with good electrical contact between the crack surfaces have only minor effect on the resistance of the array. In this mechanical fatigue research of ball grid arrays, the fatigue damage was continually followed by simultaneously measuring maximum load and electrical resistance. Experimental details, results, and analysis of the results are given including a Paris relation fit to the data. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance | |
type | Journal Paper | |
journal volume | 134 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4006708 | |
journal fristpage | 31006 | |
identifier eissn | 1043-7398 | |
keywords | Electrical resistance | |
keywords | Stress | |
keywords | Fracture (Materials) | |
keywords | Failure | |
keywords | Fatigue cracks | |
keywords | Ball-Grid-Array packaging | |
keywords | Shear (Mechanics) | |
keywords | Cycles | |
keywords | Fatigue | |
keywords | Displacement AND Solders | |
tree | Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003 | |
contenttype | Fulltext | |