Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected DevicesSource: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003::page 31002Author:H. Kück
,
Thomas Fellner
,
Elena Zukowski
,
H. Richter
,
M. Schober
,
Jürgen Wilde
,
P. Buckmüller
DOI: 10.1115/1.4006927Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional three-dimensional substrates, produced by thermoplastic injection moulding for large-series applications. The assembly process and subsequently the durability of press-fit interconnections has been modeled and proved with a finite element software. Especially, a simulation tool for process optimizations was created and applied. In order to obtain realistic results, a creep model for the investigated base material, a liquid-crystal polymer (LCP), was generated and verified by experiments. Required friction coefficients between metal pin and base material were determined by adapting simulations and experiments. Retention forces of pins pressed into substrate holes during as well after the assembly process, and after temperature loads were predicted by simulations. Additionally, the decreasing extraction forces over time due to creep in the thermoplastic base material have been predicted for different storage temperatures as well with finite element analyses. Following, the numerical results of the process and reliability modeling were verified by experiments. It is concluded that the behavior of the mechanical contact of the pin-substrate system, can be suitably described time- and temperature-dependent.
keyword(s): Force , Temperature , Stress , Presses , Modeling , Reliability AND Creep ,
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contributor author | H. Kück | |
contributor author | Thomas Fellner | |
contributor author | Elena Zukowski | |
contributor author | H. Richter | |
contributor author | M. Schober | |
contributor author | Jürgen Wilde | |
contributor author | P. Buckmüller | |
date accessioned | 2017-05-09T00:49:24Z | |
date available | 2017-05-09T00:49:24Z | |
date copyright | September, 2012 | |
date issued | 2012 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-926029#031002_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/148572 | |
description abstract | This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional three-dimensional substrates, produced by thermoplastic injection moulding for large-series applications. The assembly process and subsequently the durability of press-fit interconnections has been modeled and proved with a finite element software. Especially, a simulation tool for process optimizations was created and applied. In order to obtain realistic results, a creep model for the investigated base material, a liquid-crystal polymer (LCP), was generated and verified by experiments. Required friction coefficients between metal pin and base material were determined by adapting simulations and experiments. Retention forces of pins pressed into substrate holes during as well after the assembly process, and after temperature loads were predicted by simulations. Additionally, the decreasing extraction forces over time due to creep in the thermoplastic base material have been predicted for different storage temperatures as well with finite element analyses. Following, the numerical results of the process and reliability modeling were verified by experiments. It is concluded that the behavior of the mechanical contact of the pin-substrate system, can be suitably described time- and temperature-dependent. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices | |
type | Journal Paper | |
journal volume | 134 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4006927 | |
journal fristpage | 31002 | |
identifier eissn | 1043-7398 | |
keywords | Force | |
keywords | Temperature | |
keywords | Stress | |
keywords | Presses | |
keywords | Modeling | |
keywords | Reliability AND Creep | |
tree | Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003 | |
contenttype | Fulltext |