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    Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

    Source: Journal of Thermal Science and Engineering Applications:;2011:;volume( 003 ):;issue: 002::page 21001
    Author:
    Hemin Hu
    ,
    Jiahui Zhang
    ,
    Xiaoze Du
    ,
    Lijun Yang
    DOI: 10.1115/1.4004079
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Liquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel shapes are investigated, such as alternating elliptical channel and alternating rectangular channel (AR-C). Their performances are compared with that of three traditional straight channel shapes, as straight circular channel, straight elliptical channel, and straight rectangular channel. A heat sink with uniform and discrete heat sources is studied. Thermal and hydraulic characteristics in the heat sink are simulated using computational fluid dynamics approach, with water as coolant. The results show that the AR-C has the highest thermal performance with a little penalty on pressure drop, considering fixed channel hydraulic diameter and coolant volumetric flow rate. Geometry optimization is investigated for the AR-C, as well as the effect of channel density. It is found that higher channel density can improve both thermal performance and hydraulic resistance. It is concluded that alternating channel can improve cold plate performance and should be taken into application to power electronics cooling.
    keyword(s): Flow (Dynamics) , Channels (Hydraulic engineering) , Coolants , Heat sinks , Electrical resistance , Computer cooling , Heat , Heat transfer , Geometry AND Density ,
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      Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

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    http://yetl.yabesh.ir/yetl1/handle/yetl/147638
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    contributor authorHemin Hu
    contributor authorJiahui Zhang
    contributor authorXiaoze Du
    contributor authorLijun Yang
    date accessioned2017-05-09T00:47:01Z
    date available2017-05-09T00:47:01Z
    date copyrightJune, 2011
    date issued2011
    identifier issn1948-5085
    identifier otherJTSEBV-28830#021001_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/147638
    description abstractLiquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel shapes are investigated, such as alternating elliptical channel and alternating rectangular channel (AR-C). Their performances are compared with that of three traditional straight channel shapes, as straight circular channel, straight elliptical channel, and straight rectangular channel. A heat sink with uniform and discrete heat sources is studied. Thermal and hydraulic characteristics in the heat sink are simulated using computational fluid dynamics approach, with water as coolant. The results show that the AR-C has the highest thermal performance with a little penalty on pressure drop, considering fixed channel hydraulic diameter and coolant volumetric flow rate. Geometry optimization is investigated for the AR-C, as well as the effect of channel density. It is found that higher channel density can improve both thermal performance and hydraulic resistance. It is concluded that alternating channel can improve cold plate performance and should be taken into application to power electronics cooling.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling
    typeJournal Paper
    journal volume3
    journal issue2
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4004079
    journal fristpage21001
    identifier eissn1948-5093
    keywordsFlow (Dynamics)
    keywordsChannels (Hydraulic engineering)
    keywordsCoolants
    keywordsHeat sinks
    keywordsElectrical resistance
    keywordsComputer cooling
    keywordsHeat
    keywordsHeat transfer
    keywordsGeometry AND Density
    treeJournal of Thermal Science and Engineering Applications:;2011:;volume( 003 ):;issue: 002
    contenttypeFulltext
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