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contributor authorHemin Hu
contributor authorJiahui Zhang
contributor authorXiaoze Du
contributor authorLijun Yang
date accessioned2017-05-09T00:47:01Z
date available2017-05-09T00:47:01Z
date copyrightJune, 2011
date issued2011
identifier issn1948-5085
identifier otherJTSEBV-28830#021001_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/147638
description abstractLiquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel shapes are investigated, such as alternating elliptical channel and alternating rectangular channel (AR-C). Their performances are compared with that of three traditional straight channel shapes, as straight circular channel, straight elliptical channel, and straight rectangular channel. A heat sink with uniform and discrete heat sources is studied. Thermal and hydraulic characteristics in the heat sink are simulated using computational fluid dynamics approach, with water as coolant. The results show that the AR-C has the highest thermal performance with a little penalty on pressure drop, considering fixed channel hydraulic diameter and coolant volumetric flow rate. Geometry optimization is investigated for the AR-C, as well as the effect of channel density. It is found that higher channel density can improve both thermal performance and hydraulic resistance. It is concluded that alternating channel can improve cold plate performance and should be taken into application to power electronics cooling.
publisherThe American Society of Mechanical Engineers (ASME)
titleAnalysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling
typeJournal Paper
journal volume3
journal issue2
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4004079
journal fristpage21001
identifier eissn1948-5093
keywordsFlow (Dynamics)
keywordsChannels (Hydraulic engineering)
keywordsCoolants
keywordsHeat sinks
keywordsElectrical resistance
keywordsComputer cooling
keywordsHeat
keywordsHeat transfer
keywordsGeometry AND Density
treeJournal of Thermal Science and Engineering Applications:;2011:;volume( 003 ):;issue: 002
contenttypeFulltext


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