| contributor author | Marta Rencz | |
| date accessioned | 2017-05-09T00:43:13Z | |
| date available | 2017-05-09T00:43:13Z | |
| date copyright | March, 2011 | |
| date issued | 2011 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26312#010301_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145815 | |
| description abstract | Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer Society Test Technology Technical Council and the CMP Laboratory, in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. The Workshop had participants from 25 countries. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09 | |
| type | Journal Paper | |
| journal volume | 133 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3565444 | |
| journal fristpage | 10301 | |
| identifier eissn | 1043-7398 | |
| keywords | Integrated circuits | |
| tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 001 | |
| contenttype | Fulltext | |
