| contributor author | Wei Wang | |
| contributor author | Hongseok Noh | |
| contributor author | Peter J. Hesketh | |
| contributor author | Yong Huang | |
| contributor author | Nicole Coutris | |
| date accessioned | 2017-05-09T00:37:16Z | |
| date available | 2017-05-09T00:37:16Z | |
| date copyright | March, 2010 | |
| date issued | 2010 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26302#014501_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142975 | |
| description abstract | The transverse shear effect has been frequently ignored in determining the debonding-related energy release rate and the phase angle in the blister test, resulting in underestimated values. This study aims to study the effect of shear force on the energy release rate and phase angle prediction in the blister test. A generalized approach is proposed to predict them under the effect of shear force. The predictions show that when the ratio of the film thickness to the debonded film window radius is large (such as 0.05), the transverse shear effect cannot be ignored in determining the energy release rate and the phase angle. The study also further illustrates the importance of including the shear force contribution in estimation and how this importance depends on the film thickness to debonded radius ratio, as well as the elastic mismatch. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Evaluation of Transverse Shear Effect on Film Delamination in Blister Test | |
| type | Journal Paper | |
| journal volume | 132 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4000717 | |
| journal fristpage | 14501 | |
| identifier eissn | 1043-7398 | |
| keywords | Force | |
| keywords | Shear (Mechanics) | |
| keywords | Film thickness | |
| keywords | Stress AND Delamination | |
| tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 001 | |
| contenttype | Fulltext | |
