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    An Investigation of Flat-Plate Oscillating Heat Pipes

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004::page 41009
    Author:
    Peng Cheng
    ,
    Scott Thompson
    ,
    Joe Boswell
    ,
    H. B. Ma
    DOI: 10.1115/1.4002726
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with 0.0003 vol % gold/water nanofluids achieved a thermal resistance of 0.078 K/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when the nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the thermal performance of the FP-OHP. Results presented here will assist in the optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in OHPs.
    keyword(s): Heat pipes , Condensers (steam plant) , Diamonds , Flat plates , Nanofluids , Thermal resistance , Water , Gravity (Force) , Temperature , Heat transfer , Cooling , Fluids , Channels (Hydraulic engineering) , Operating temperature , Copper , Heating , Motion AND Heat flux ,
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      An Investigation of Flat-Plate Oscillating Heat Pipes

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    http://yetl.yabesh.ir/yetl1/handle/yetl/142931
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    contributor authorPeng Cheng
    contributor authorScott Thompson
    contributor authorJoe Boswell
    contributor authorH. B. Ma
    date accessioned2017-05-09T00:37:11Z
    date available2017-05-09T00:37:11Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26309#041009_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142931
    description abstractThe heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with 0.0003 vol % gold/water nanofluids achieved a thermal resistance of 0.078 K/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when the nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the thermal performance of the FP-OHP. Results presented here will assist in the optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in OHPs.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Investigation of Flat-Plate Oscillating Heat Pipes
    typeJournal Paper
    journal volume132
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4002726
    journal fristpage41009
    identifier eissn1043-7398
    keywordsHeat pipes
    keywordsCondensers (steam plant)
    keywordsDiamonds
    keywordsFlat plates
    keywordsNanofluids
    keywordsThermal resistance
    keywordsWater
    keywordsGravity (Force)
    keywordsTemperature
    keywordsHeat transfer
    keywordsCooling
    keywordsFluids
    keywordsChannels (Hydraulic engineering)
    keywordsOperating temperature
    keywordsCopper
    keywordsHeating
    keywordsMotion AND Heat flux
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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