contributor author | Peng Cheng | |
contributor author | Scott Thompson | |
contributor author | Joe Boswell | |
contributor author | H. B. Ma | |
date accessioned | 2017-05-09T00:37:11Z | |
date available | 2017-05-09T00:37:11Z | |
date copyright | December, 2010 | |
date issued | 2010 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26309#041009_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142931 | |
description abstract | The heat transfer performance of flat-plate oscillating heat pipes (FP-OHPs) was investigated experimentally and theoretically. Two layers of channels were created by machining grooves on both sides of a copper plate in order to increase the channel number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power input and operating temperature. The FP-OHP charged with 0.0003 vol % gold/water nanofluids achieved a thermal resistance of 0.078 K/W while removing 560 W with a heat flux of 86.8 W/cm2. The thermal resistance was further decreased when the nanofluid was used as the working fluid. A mathematical model predicting the heat transfer performance was developed to predict the thermal performance of the FP-OHP. Results presented here will assist in the optimization of the FP-OHP and provide a better understanding of heat transfer mechanisms occurring in OHPs. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Investigation of Flat-Plate Oscillating Heat Pipes | |
type | Journal Paper | |
journal volume | 132 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4002726 | |
journal fristpage | 41009 | |
identifier eissn | 1043-7398 | |
keywords | Heat pipes | |
keywords | Condensers (steam plant) | |
keywords | Diamonds | |
keywords | Flat plates | |
keywords | Nanofluids | |
keywords | Thermal resistance | |
keywords | Water | |
keywords | Gravity (Force) | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Cooling | |
keywords | Fluids | |
keywords | Channels (Hydraulic engineering) | |
keywords | Operating temperature | |
keywords | Copper | |
keywords | Heating | |
keywords | Motion AND Heat flux | |
tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004 | |
contenttype | Fulltext | |