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    Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004::page 41004
    Author:
    Y. Sungtaek Ju
    DOI: 10.1115/1.4002896
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Subambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a new design concept for compact solid-state refrigerators based on the electrocaloric (EC) effect. The EC refrigerators are attractive because they may approach the Carnot efficiency more closely than Peltier coolers, which involve intrinsically irreversible processes. To address parasitic losses and other practical considerations that limit the actual performance of EC coolers, we incorporate laterally interdigitated electrode arrays with high effective thermal conductivity and switchable thermal interfaces with high switching ratios and high off-state thermal resistance. Numerical simulations are used to quantify the impact of various design parameters and the expected performance of the module, focusing in particular on the heat diffusion time and RC thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities >10 W/cm2 may be achieved across ΔT of the order of 10 K at coefficient of performance (COP)>10. The present work motivates further experimental studies to develop advanced electrocaloric materials and fabricate/test cooling modules to assess the feasibility of their practical application.
    keyword(s): Cooling , Electrodes , Thermal conductivity , Temperature , Manufacturing AND Pyroelectricity ,
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      Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

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    http://yetl.yabesh.ir/yetl1/handle/yetl/142926
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    contributor authorY. Sungtaek Ju
    date accessioned2017-05-09T00:37:11Z
    date available2017-05-09T00:37:11Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26309#041004_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142926
    description abstractSubambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a new design concept for compact solid-state refrigerators based on the electrocaloric (EC) effect. The EC refrigerators are attractive because they may approach the Carnot efficiency more closely than Peltier coolers, which involve intrinsically irreversible processes. To address parasitic losses and other practical considerations that limit the actual performance of EC coolers, we incorporate laterally interdigitated electrode arrays with high effective thermal conductivity and switchable thermal interfaces with high switching ratios and high off-state thermal resistance. Numerical simulations are used to quantify the impact of various design parameters and the expected performance of the module, focusing in particular on the heat diffusion time and RC thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities >10 W/cm2 may be achieved across ΔT of the order of 10 K at coefficient of performance (COP)>10. The present work motivates further experimental studies to develop advanced electrocaloric materials and fabricate/test cooling modules to assess the feasibility of their practical application.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSolid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling
    typeJournal Paper
    journal volume132
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4002896
    journal fristpage41004
    identifier eissn1043-7398
    keywordsCooling
    keywordsElectrodes
    keywordsThermal conductivity
    keywordsTemperature
    keywordsManufacturing AND Pyroelectricity
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
    contenttypeFulltext
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