contributor author | Xiaoqin Lin | |
contributor author | Le Luo | |
date accessioned | 2017-05-09T00:32:22Z | |
date available | 2017-05-09T00:32:22Z | |
date copyright | March, 2009 | |
date issued | 2009 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26292#011014_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/140331 | |
description abstract | Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13×13 area-array Sn/3.0Ag solder bumps of 70 μm in height and 90 μm in diameter were fabricated with a smooth and shiny surface and with a uniform distribution of Ag. During multireflow, the scalloped Cu6Sn5 phase grows by a ripening process. Volume shrinkage was the main reason for the formation of microvoids during multireflow. The average shear strength of solder bumps on TiW/Cu under bump metallurgy (UBM) increased with reflow times. The electroplating process is suitable for mass production of well-controlled geometry and uniformity of SnAg solder bumps. Microvoids have trivial negative impacts on the solder bonds. The combination of TiW/Cu UBM and SnAg solder is reliable. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Sub-100 μm SnAg Solder Bumping Technology and the Bump Reliability | |
type | Journal Paper | |
journal volume | 131 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2957333 | |
journal fristpage | 11014 | |
identifier eissn | 1043-7398 | |
keywords | Solders | |
keywords | Shear strength AND Reliability | |
tree | Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001 | |
contenttype | Fulltext | |