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    Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002::page 21005
    Author:
    Afzal Husain
    ,
    Kwang-Yong Kim
    DOI: 10.1115/1.3103931
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.
    keyword(s): Design , Optimization , Heat sinks , Thermal resistance , Microchannels , Shapes , Flow (Dynamics) , Heat transfer , Response surface methodology AND Polynomials ,
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      Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/140304
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    • Journal of Electronic Packaging

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    contributor authorAfzal Husain
    contributor authorKwang-Yong Kim
    date accessioned2017-05-09T00:32:19Z
    date available2017-05-09T00:32:19Z
    date copyrightJune, 2009
    date issued2009
    identifier issn1528-9044
    identifier otherJEPAE4-26295#021005_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140304
    description abstractA microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
    typeJournal Paper
    journal volume131
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3103931
    journal fristpage21005
    identifier eissn1043-7398
    keywordsDesign
    keywordsOptimization
    keywordsHeat sinks
    keywordsThermal resistance
    keywordsMicrochannels
    keywordsShapes
    keywordsFlow (Dynamics)
    keywordsHeat transfer
    keywordsResponse surface methodology AND Polynomials
    treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian