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    Squeezing Flow of a Power Law Fluid Between Grooved Plates

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003::page 31007
    Author:
    Drew A. Davidson
    ,
    Bahgat G. Sammakia
    DOI: 10.1115/1.3144158
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Surface microchannels can accelerate squeezing flow of a fluid in a thin gap between parallel plates. Using a computational model and restricting attention to power law fluid, a parametric study is made of the influence of channel size for a certain family of channel patterns, with results tabulated for general use. An approximate heat conduction model is used to estimate the effect of channel size and pattern on resistance to heat flow normal to the fluid layer.
    keyword(s): Flow (Dynamics) , Fluids , Channels (Hydraulic engineering) , Microchannels , Plates (structures) , Force AND Flat plates ,
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      Squeezing Flow of a Power Law Fluid Between Grooved Plates

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    http://yetl.yabesh.ir/yetl1/handle/yetl/140286
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    contributor authorDrew A. Davidson
    contributor authorBahgat G. Sammakia
    date accessioned2017-05-09T00:32:17Z
    date available2017-05-09T00:32:17Z
    date copyrightSeptember, 2009
    date issued2009
    identifier issn1528-9044
    identifier otherJEPAE4-26298#031007_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140286
    description abstractSurface microchannels can accelerate squeezing flow of a fluid in a thin gap between parallel plates. Using a computational model and restricting attention to power law fluid, a parametric study is made of the influence of channel size for a certain family of channel patterns, with results tabulated for general use. An approximate heat conduction model is used to estimate the effect of channel size and pattern on resistance to heat flow normal to the fluid layer.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSqueezing Flow of a Power Law Fluid Between Grooved Plates
    typeJournal Paper
    journal volume131
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3144158
    journal fristpage31007
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsFluids
    keywordsChannels (Hydraulic engineering)
    keywordsMicrochannels
    keywordsPlates (structures)
    keywordsForce AND Flat plates
    treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian