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    Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 004::page 44502
    Author:
    D. Bhate
    ,
    J. Zhao
    ,
    V. Gupta
    ,
    G. Subbarayan
    ,
    D. Edwards
    DOI: 10.1115/1.4000208
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in package constructions employed by the microelectronics industry. While material behavior can be captured by means of valid constitutive models, the empirical failure models in common use are strongly dependent on package construction due to the fact that they are derived from tests of solder joints with heterogeneous stress and microstructural variation. Despite this limitation, the empirical models have been used to identify reliable choices among package design alternatives. In this technical brief, some of the key limitations that the user of empirical models must be aware of are addressed. Physical arguments are proposed in order to justify the appropriate assumptions that may be made in the life model. Using data from two different sources in the literature, the constants in the empirical models are shown to be dependent on the solder joint geometry. Alternative fits to experimental data that reduce the dependence of the fits on solder joint geometry are proposed.
    keyword(s): Geometry , Solder joints , Solders , Failure , Fatigue , Alloys AND Energy dissipation ,
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      Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

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    http://yetl.yabesh.ir/yetl1/handle/yetl/140276
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    contributor authorD. Bhate
    contributor authorJ. Zhao
    contributor authorV. Gupta
    contributor authorG. Subbarayan
    contributor authorD. Edwards
    date accessioned2017-05-09T00:32:16Z
    date available2017-05-09T00:32:16Z
    date copyrightDecember, 2009
    date issued2009
    identifier issn1528-9044
    identifier otherJEPAE4-26300#044502_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140276
    description abstractPredicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in package constructions employed by the microelectronics industry. While material behavior can be captured by means of valid constitutive models, the empirical failure models in common use are strongly dependent on package construction due to the fact that they are derived from tests of solder joints with heterogeneous stress and microstructural variation. Despite this limitation, the empirical models have been used to identify reliable choices among package design alternatives. In this technical brief, some of the key limitations that the user of empirical models must be aware of are addressed. Physical arguments are proposed in order to justify the appropriate assumptions that may be made in the life model. Using data from two different sources in the literature, the constants in the empirical models are shown to be dependent on the solder joint geometry. Alternative fits to experimental data that reduce the dependence of the fits on solder joint geometry are proposed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleImproved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
    typeJournal Paper
    journal volume131
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4000208
    journal fristpage44502
    identifier eissn1043-7398
    keywordsGeometry
    keywordsSolder joints
    keywordsSolders
    keywordsFailure
    keywordsFatigue
    keywordsAlloys AND Energy dissipation
    treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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