Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

Abstract

The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting laser (VCSEL) and the alkali-metal vapor cell. Each of these must be maintained at 70+/−0.1°C even over large ambient temperature variations of 0–50°C. Thus the physics package of a CSAC device, which contains the vapor cell, VCSEL, and optical components, must have a very high thermal resistance, greater than 5.83°C/m W, to operate in 0°C ambient temperatures while dissipating less than 12 mW of power for heating. To create such a high level of insulation, the physics package is enclosed in a gold coated vacuum package and is suspended on a specially designed structure made from Cirlex, a type of polyimide. The thermal performance of the suspended physics package has been evaluated by measuring the total thermal resistance from a mockup package with and without an enclosure. Without an enclosure, the thermal resistance was found to be 1.07°C/m W. With the enclosure, the resistance increases to 1.71°C/m W. These two cases were modeled using finite element analysis (FEA), the results of which were found to match well with experimental measurements. A FEA model of the real design of the enclosed and suspended physics package was then modeled and was found to have a thermal resistance of 6.28°C/m W, which meets the project requirements of greater than 5.83°C/m W. The structural performance of the physics package was measured by shock-testing, a physics package mockup and recording the response with a high-speed video camera. The shock tests were modeled using dynamic FEA and were found to match well with the displacement measurements. A FEA model of the final design, not the mockup, of the physics package was created and was used to predict that the physics package will survive a 1800 g shock of any duration in any direction without exceeding the Cirlex yield stress of 49 MPa. In addition, the package will survive a 10,000 g shock of any duration in any direction without exceeding the Cirlex tensile stress of 229 MPa.