contributor author | Hao Lu | |
contributor author | Chun Yu | |
contributor author | Peilin Li | |
contributor author | Junmei Chen | |
date accessioned | 2017-05-09T00:27:34Z | |
date available | 2017-05-09T00:27:34Z | |
date copyright | September, 2008 | |
date issued | 2008 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26287#031008_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137757 | |
description abstract | The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder joints. Finite element analysis shows that the crowding factor is directly proportional to the cross-sectional area ratio between Cu line and contact opening at the cathode side. Cu∕Sn‐3.0Ag‐0.5Cu∕Cu solder joints with Cu line in different widths were designed and tested under 1×103A∕cm2 at 60°C for 430h. The experiment results show that big voids induced by electromigration are only formed at the structure with a narrower line. Moreover, the growth of intermetallic compound layers, as well as dissolution of Cu at the cathode side, is accelerated by smaller current crowding, whereas impeded by a bigger one. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints | |
type | Journal Paper | |
journal volume | 130 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2957322 | |
journal fristpage | 31008 | |
identifier eissn | 1043-7398 | |
keywords | Solders | |
keywords | Electrodiffusion | |
keywords | Current density | |
keywords | Lead-free solders | |
keywords | Solder joints | |
keywords | Finite element analysis | |
keywords | Intermetallic compounds AND Atoms | |
tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003 | |
contenttype | Fulltext | |