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    Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003::page 31008
    Author:
    Hao Lu
    ,
    Chun Yu
    ,
    Peilin Li
    ,
    Junmei Chen
    DOI: 10.1115/1.2957322
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder joints. Finite element analysis shows that the crowding factor is directly proportional to the cross-sectional area ratio between Cu line and contact opening at the cathode side. Cu∕Sn‐3.0Ag‐0.5Cu∕Cu solder joints with Cu line in different widths were designed and tested under 1×103A∕cm2 at 60°C for 430h. The experiment results show that big voids induced by electromigration are only formed at the structure with a narrower line. Moreover, the growth of intermetallic compound layers, as well as dissolution of Cu at the cathode side, is accelerated by smaller current crowding, whereas impeded by a bigger one.
    keyword(s): Solders , Electrodiffusion , Current density , Lead-free solders , Solder joints , Finite element analysis , Intermetallic compounds AND Atoms ,
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      Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

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    http://yetl.yabesh.ir/yetl1/handle/yetl/137757
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    contributor authorHao Lu
    contributor authorChun Yu
    contributor authorPeilin Li
    contributor authorJunmei Chen
    date accessioned2017-05-09T00:27:34Z
    date available2017-05-09T00:27:34Z
    date copyrightSeptember, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26287#031008_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137757
    description abstractThe current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder joints. Finite element analysis shows that the crowding factor is directly proportional to the cross-sectional area ratio between Cu line and contact opening at the cathode side. Cu∕Sn‐3.0Ag‐0.5Cu∕Cu solder joints with Cu line in different widths were designed and tested under 1×103A∕cm2 at 60°C for 430h. The experiment results show that big voids induced by electromigration are only formed at the structure with a narrower line. Moreover, the growth of intermetallic compound layers, as well as dissolution of Cu at the cathode side, is accelerated by smaller current crowding, whereas impeded by a bigger one.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCurrent Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
    typeJournal Paper
    journal volume130
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2957322
    journal fristpage31008
    identifier eissn1043-7398
    keywordsSolders
    keywordsElectrodiffusion
    keywordsCurrent density
    keywordsLead-free solders
    keywordsSolder joints
    keywordsFinite element analysis
    keywordsIntermetallic compounds AND Atoms
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003
    contenttypeFulltext
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