| contributor author | Min Pei | |
| contributor author | Jianmin Qu | |
| date accessioned | 2017-05-09T00:27:33Z | |
| date available | 2017-05-09T00:27:33Z | |
| date copyright | September, 2008 | |
| date issued | 2008 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26287#031004_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137752 | |
| description abstract | In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic region; at a much smaller length scale the eutectic region consists of submicron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of lanthanum doped SnAg solders. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys | |
| type | Journal Paper | |
| journal volume | 130 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2957321 | |
| journal fristpage | 31004 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Nanoindentation | |
| keywords | Particulate matter | |
| keywords | Stress AND Modeling | |
| tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003 | |
| contenttype | Fulltext | |