YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004::page 41004
    Author:
    S. B. Park
    ,
    Rahul Joshi
    ,
    Izhar Ahmed
    ,
    Soonwan Chung
    DOI: 10.1115/1.2993146
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.
    keyword(s): Deformation , Temperature , Ceramics , Solders , Computer simulation , Manufacturing , Reliability , Finite element analysis , Solder joints , Ball-Grid-Array packaging , Computational fluid dynamics , Temperature distribution AND Cycles ,
    • Download: (1.522Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/137736
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorS. B. Park
    contributor authorRahul Joshi
    contributor authorIzhar Ahmed
    contributor authorSoonwan Chung
    date accessioned2017-05-09T00:27:31Z
    date available2017-05-09T00:27:31Z
    date copyrightDecember, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26289#041004_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137736
    description abstractExperimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleComparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
    typeJournal Paper
    journal volume130
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2993146
    journal fristpage41004
    identifier eissn1043-7398
    keywordsDeformation
    keywordsTemperature
    keywordsCeramics
    keywordsSolders
    keywordsComputer simulation
    keywordsManufacturing
    keywordsReliability
    keywordsFinite element analysis
    keywordsSolder joints
    keywordsBall-Grid-Array packaging
    keywordsComputational fluid dynamics
    keywordsTemperature distribution AND Cycles
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian