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    The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001::page 76
    Author:
    J. Richard Culham
    ,
    Waqar A. Khan
    ,
    M. Michael Yovanovich
    ,
    Yuri S. Muzychka
    DOI: 10.1115/1.2429713
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. While a cursory review of the thermal network established between heat sources and sinks in typical plate fin heat sinks would indicate that the film resistance at the fluid-solid boundary dominates, it is shown that the effects of other resistance elements, such as the spreading resistance and the material resistance, although of lesser magnitude, play an important role in the optimization and selection of heat sink design conditions. An analytical model is presented for calculating the best possible design parameters for plate fin heat sinks using an entropy generation minimization procedure with constrained variable optimization. The method characterizes the contribution to entropy production of all relevant thermal resistances in the path between source and sink as well as the contribution to viscous dissipation associated with fluid flow at the boundaries of the heat sink. The minimization procedure provides a fast, convenient method for establishing the “best case” design characteristics of plate fin heat sinks given a set of prescribed boundary conditions. It is shown that heat sinks made of composite materials containing nonmetallic constituents, with a thermal conductivity as much as an order of magnitude less that typical metallic heat sinks, can provide an effective alternative where performance, cost, and manufacturability are of importance. It is also shown that the spreading resistance encountered when heat flows from a heat source to the base plate of a heat sink, while significant, can be compensated for by making appropriate design modifications to the heat sink.
    keyword(s): Electrical resistance , Design , Heat sinks , Thermal conductivity AND Optimization ,
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      The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135590
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    contributor authorJ. Richard Culham
    contributor authorWaqar A. Khan
    contributor authorM. Michael Yovanovich
    contributor authorYuri S. Muzychka
    date accessioned2017-05-09T00:23:28Z
    date available2017-05-09T00:23:28Z
    date copyrightMarch, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26272#76_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135590
    description abstractThe thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. While a cursory review of the thermal network established between heat sources and sinks in typical plate fin heat sinks would indicate that the film resistance at the fluid-solid boundary dominates, it is shown that the effects of other resistance elements, such as the spreading resistance and the material resistance, although of lesser magnitude, play an important role in the optimization and selection of heat sink design conditions. An analytical model is presented for calculating the best possible design parameters for plate fin heat sinks using an entropy generation minimization procedure with constrained variable optimization. The method characterizes the contribution to entropy production of all relevant thermal resistances in the path between source and sink as well as the contribution to viscous dissipation associated with fluid flow at the boundaries of the heat sink. The minimization procedure provides a fast, convenient method for establishing the “best case” design characteristics of plate fin heat sinks given a set of prescribed boundary conditions. It is shown that heat sinks made of composite materials containing nonmetallic constituents, with a thermal conductivity as much as an order of magnitude less that typical metallic heat sinks, can provide an effective alternative where performance, cost, and manufacturability are of importance. It is also shown that the spreading resistance encountered when heat flows from a heat source to the base plate of a heat sink, while significant, can be compensated for by making appropriate design modifications to the heat sink.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks
    typeJournal Paper
    journal volume129
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2429713
    journal fristpage76
    journal lastpage81
    identifier eissn1043-7398
    keywordsElectrical resistance
    keywordsDesign
    keywordsHeat sinks
    keywordsThermal conductivity AND Optimization
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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