Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor ChamberSource: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003::page 348Author:Yen-Shu Chen
,
Kuo-Hsiang Chien
,
Tzu-Chen Hung
,
Yuh-Ming Ferng
,
Bau-Shei Pei
,
Chi-Chuan Wang
DOI: 10.1115/1.2753970Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by that of a spreader plate, is investigated. The numerical results show a very good agreement with the analytical solutions. From the calculated results, the spreading resistance of the conduction plates with a small aspect ratio is higher than the one-dimensional conduction resistance. Calculated results also show that the spreading ability of a metal plate would be affected slightly by the external convective heat-transfer coefficient when the ratio of the longitudinal heat convection to the lateral heat spreading is less than 0.1. In addition to the numerical analysis, experimental comparisons between copper∕aluminum plates and a vapor chamber having the same thickness have been conducted. The experimental results show that the thermal resistance of the metal plates is independent of input power whereas that of the vapor chamber shows a noticeable drop with increased power. For the influence of concentrated heat source, the surface temperature distributions for the metal plates become concentrated with a reduced aspect ratio. However, the variations of the aspect ratio and the input power would yield minor effects to the surface temperature distribution of the vapor chamber. As compared with the conduction plates, the vapor chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources.
keyword(s): Heat , Temperature , Vapors , Plates (structures) , Temperature distribution , Thermal resistance , Thickness , Flat heat pipes , Heat conduction , Electrical resistance , Metals , Heat transfer AND Drops ,
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contributor author | Yen-Shu Chen | |
contributor author | Kuo-Hsiang Chien | |
contributor author | Tzu-Chen Hung | |
contributor author | Yuh-Ming Ferng | |
contributor author | Bau-Shei Pei | |
contributor author | Chi-Chuan Wang | |
date accessioned | 2017-05-09T00:23:23Z | |
date available | 2017-05-09T00:23:23Z | |
date copyright | September, 2007 | |
date issued | 2007 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26276#348_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135560 | |
description abstract | This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by that of a spreader plate, is investigated. The numerical results show a very good agreement with the analytical solutions. From the calculated results, the spreading resistance of the conduction plates with a small aspect ratio is higher than the one-dimensional conduction resistance. Calculated results also show that the spreading ability of a metal plate would be affected slightly by the external convective heat-transfer coefficient when the ratio of the longitudinal heat convection to the lateral heat spreading is less than 0.1. In addition to the numerical analysis, experimental comparisons between copper∕aluminum plates and a vapor chamber having the same thickness have been conducted. The experimental results show that the thermal resistance of the metal plates is independent of input power whereas that of the vapor chamber shows a noticeable drop with increased power. For the influence of concentrated heat source, the surface temperature distributions for the metal plates become concentrated with a reduced aspect ratio. However, the variations of the aspect ratio and the input power would yield minor effects to the surface temperature distribution of the vapor chamber. As compared with the conduction plates, the vapor chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber | |
type | Journal Paper | |
journal volume | 129 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2753970 | |
journal fristpage | 348 | |
journal lastpage | 355 | |
identifier eissn | 1043-7398 | |
keywords | Heat | |
keywords | Temperature | |
keywords | Vapors | |
keywords | Plates (structures) | |
keywords | Temperature distribution | |
keywords | Thermal resistance | |
keywords | Thickness | |
keywords | Flat heat pipes | |
keywords | Heat conduction | |
keywords | Electrical resistance | |
keywords | Metals | |
keywords | Heat transfer AND Drops | |
tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003 | |
contenttype | Fulltext |