Spray Cooling of IGBT DevicesSource: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003::page 316Author:Robert G. Mertens
,
Louis Chow
,
Daniel P. Rini
,
Louis Turek
,
Kalpathy B. Sundaram
,
R. Brian Cregger
,
Benjamin A. Saarloos
DOI: 10.1115/1.2753937Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825W∕cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditional cooling methods.
keyword(s): Temperature , Cooling , Electric potential , Sprays , Water , Heat flux , Junctions AND Cycles ,
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contributor author | Robert G. Mertens | |
contributor author | Louis Chow | |
contributor author | Daniel P. Rini | |
contributor author | Louis Turek | |
contributor author | Kalpathy B. Sundaram | |
contributor author | R. Brian Cregger | |
contributor author | Benjamin A. Saarloos | |
date accessioned | 2017-05-09T00:23:22Z | |
date available | 2017-05-09T00:23:22Z | |
date copyright | September, 2007 | |
date issued | 2007 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26276#316_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135555 | |
description abstract | The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825W∕cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditional cooling methods. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Spray Cooling of IGBT Devices | |
type | Journal Paper | |
journal volume | 129 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2753937 | |
journal fristpage | 316 | |
journal lastpage | 323 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Cooling | |
keywords | Electric potential | |
keywords | Sprays | |
keywords | Water | |
keywords | Heat flux | |
keywords | Junctions AND Cycles | |
tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003 | |
contenttype | Fulltext |