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    Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003::page 229
    Author:
    S. Radhakrishnan
    ,
    L. Nguyen
    ,
    W. Mazotti
    ,
    G. Subbarayan
    DOI: 10.1115/1.2753885
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There is considerable uncertainty in the prediction of performance of a system, due mainly to idealizations in geometry, material behavior, and loading history. Uncertainties in geometry can be predicted and controlled using tighter tolerances. However, the models currently used to describe material behavior are mostly deterministic. To predict the coupling efficiency of a photonic system to a greater degree of confidence, stochastic analysis procedures are necessary. As part of such an analysis, the behavior of materials must be stochastically characterized. In this paper, we present extensive experimental data on thermally and UV-cured epoxies, typically used in photonic packages to enable stochastic analysis. We perform dynamic mechanical analysis over a wide frequency and temperature range to determine the viscoelastic behavior of the epoxies. We next derive an analytical description of the time-dependent behavior of a vertical cavity surface emitting laser (VCSEL) array bonded to a substrate. We further characterize the variation in the displacement of the VCSEL array due to the stochastic, viscoelastic behavior of the bond epoxy. We carry out Monte Carlo simulation to predict the uncertainty in the coupling efficiency of a generic photonic package. We finally relate the size of the VCSEL laser array to its ability to achieve the required coupling efficiency.
    keyword(s): Temperature , Epoxy adhesives , Uncertainty , Modeling , Displacement AND Stress ,
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      Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135542
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    contributor authorS. Radhakrishnan
    contributor authorL. Nguyen
    contributor authorW. Mazotti
    contributor authorG. Subbarayan
    date accessioned2017-05-09T00:23:20Z
    date available2017-05-09T00:23:20Z
    date copyrightSeptember, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26276#229_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135542
    description abstractThere is considerable uncertainty in the prediction of performance of a system, due mainly to idealizations in geometry, material behavior, and loading history. Uncertainties in geometry can be predicted and controlled using tighter tolerances. However, the models currently used to describe material behavior are mostly deterministic. To predict the coupling efficiency of a photonic system to a greater degree of confidence, stochastic analysis procedures are necessary. As part of such an analysis, the behavior of materials must be stochastically characterized. In this paper, we present extensive experimental data on thermally and UV-cured epoxies, typically used in photonic packages to enable stochastic analysis. We perform dynamic mechanical analysis over a wide frequency and temperature range to determine the viscoelastic behavior of the epoxies. We next derive an analytical description of the time-dependent behavior of a vertical cavity surface emitting laser (VCSEL) array bonded to a substrate. We further characterize the variation in the displacement of the VCSEL array due to the stochastic, viscoelastic behavior of the bond epoxy. We carry out Monte Carlo simulation to predict the uncertainty in the coupling efficiency of a generic photonic package. We finally relate the size of the VCSEL laser array to its ability to achieve the required coupling efficiency.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
    typeJournal Paper
    journal volume129
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2753885
    journal fristpage229
    journal lastpage235
    identifier eissn1043-7398
    keywordsTemperature
    keywordsEpoxy adhesives
    keywordsUncertainty
    keywordsModeling
    keywordsDisplacement AND Stress
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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