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    Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004::page 411
    Author:
    Y. C. Lee
    ,
    C. J. Fang
    ,
    M. C. Wu
    ,
    C. H. Peng
    ,
    Y. H. Hung
    DOI: 10.1115/1.2804089
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.
    keyword(s): Design , Optimization , Disks , Multi-chip modules , Heat transfer AND Reynolds number ,
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      Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135524
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    contributor authorY. C. Lee
    contributor authorC. J. Fang
    contributor authorM. C. Wu
    contributor authorC. H. Peng
    contributor authorY. H. Hung
    date accessioned2017-05-09T00:23:18Z
    date available2017-05-09T00:23:18Z
    date copyrightDecember, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26280#411_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135524
    description abstractAn effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHeat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
    typeJournal Paper
    journal volume129
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2804089
    journal fristpage411
    journal lastpage420
    identifier eissn1043-7398
    keywordsDesign
    keywordsOptimization
    keywordsDisks
    keywordsMulti-chip modules
    keywordsHeat transfer AND Reynolds number
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004
    contenttypeFulltext
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    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian