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    Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001::page 46
    Author:
    Jong-Jin Park
    ,
    Minoru Taya
    DOI: 10.1115/1.2159008
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model, and the experimental results were found to be consistent with the predictions made by the model.
    keyword(s): Temperature , Impedance (Electricity) , Thermal conductivity , Network models , Resistors , Thickness , Design , Fillers (Materials) , Heat , Carbon nanotubes , Electrical resistance AND Thermometers ,
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      Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/133558
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    contributor authorJong-Jin Park
    contributor authorMinoru Taya
    date accessioned2017-05-09T00:19:37Z
    date available2017-05-09T00:19:37Z
    date copyrightMarch, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26259#46_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133558
    description abstractA thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model, and the experimental results were found to be consistent with the predictions made by the model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus
    typeJournal Paper
    journal volume128
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2159008
    journal fristpage46
    journal lastpage52
    identifier eissn1043-7398
    keywordsTemperature
    keywordsImpedance (Electricity)
    keywordsThermal conductivity
    keywordsNetwork models
    keywordsResistors
    keywordsThickness
    keywordsDesign
    keywordsFillers (Materials)
    keywordsHeat
    keywordsCarbon nanotubes
    keywordsElectrical resistance AND Thermometers
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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