contributor author | Jong-Jin Park | |
contributor author | Minoru Taya | |
date accessioned | 2017-05-09T00:19:37Z | |
date available | 2017-05-09T00:19:37Z | |
date copyright | March, 2006 | |
date issued | 2006 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26259#46_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133558 | |
description abstract | A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model, and the experimental results were found to be consistent with the predictions made by the model. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus | |
type | Journal Paper | |
journal volume | 128 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2159008 | |
journal fristpage | 46 | |
journal lastpage | 52 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Impedance (Electricity) | |
keywords | Thermal conductivity | |
keywords | Network models | |
keywords | Resistors | |
keywords | Thickness | |
keywords | Design | |
keywords | Fillers (Materials) | |
keywords | Heat | |
keywords | Carbon nanotubes | |
keywords | Electrical resistance AND Thermometers | |
tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001 | |
contenttype | Fulltext | |