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    Thermal Joint Resistance of Polymer-Metal Rough Interfaces

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001::page 23
    Author:
    M. Bahrami
    ,
    M. M. Yovanovich
    ,
    E. E. Marotta
    DOI: 10.1115/1.2159005
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature. The joint resistance includes two components: (i) bulk resistance of the polymer, and (ii) microcontacts resistance, i.e., constriction∕spreading resistance of the microcontacts at the interface. Performing a deformation analysis, it is shown that the deformation mode of surface asperities is plastic for most polymers studied. It is observed that the thermophysical properties of the polymer control the thermal joint resistance and the metallic surface properties have a second order effect on the thermal joint resistance. A new nondimensional parameter, the ratio of microcontacts over bulk thermal resistances, is proposed as a criterion to specify the relative importance of the microcontacts thermal resistance. The present model is compared with more than 140 experimental data points collected for a selected number of polymers. The averaged rms relative difference between the model and data is approximately 12.7%.
    keyword(s): Metals , Electrical resistance , Surface roughness , Deformation , Polymers , Temperature , Microhardness AND Stress ,
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      Thermal Joint Resistance of Polymer-Metal Rough Interfaces

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    http://yetl.yabesh.ir/yetl1/handle/yetl/133554
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    contributor authorM. Bahrami
    contributor authorM. M. Yovanovich
    contributor authorE. E. Marotta
    date accessioned2017-05-09T00:19:37Z
    date available2017-05-09T00:19:37Z
    date copyrightMarch, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26259#23_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133554
    description abstractA compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature. The joint resistance includes two components: (i) bulk resistance of the polymer, and (ii) microcontacts resistance, i.e., constriction∕spreading resistance of the microcontacts at the interface. Performing a deformation analysis, it is shown that the deformation mode of surface asperities is plastic for most polymers studied. It is observed that the thermophysical properties of the polymer control the thermal joint resistance and the metallic surface properties have a second order effect on the thermal joint resistance. A new nondimensional parameter, the ratio of microcontacts over bulk thermal resistances, is proposed as a criterion to specify the relative importance of the microcontacts thermal resistance. The present model is compared with more than 140 experimental data points collected for a selected number of polymers. The averaged rms relative difference between the model and data is approximately 12.7%.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Joint Resistance of Polymer-Metal Rough Interfaces
    typeJournal Paper
    journal volume128
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2159005
    journal fristpage23
    journal lastpage29
    identifier eissn1043-7398
    keywordsMetals
    keywordsElectrical resistance
    keywordsSurface roughness
    keywordsDeformation
    keywordsPolymers
    keywordsTemperature
    keywordsMicrohardness AND Stress
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001
    contenttypeFulltext
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