contributor author | Mudasir Ahmad | |
contributor author | Ken Hubbard | |
contributor author | Mason Hu | |
date accessioned | 2017-05-09T00:19:37Z | |
date available | 2017-05-09T00:19:37Z | |
date copyright | March, 2006 | |
date issued | 2006 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26259#98_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133550 | |
description abstract | Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298] | |
type | Journal Paper | |
journal volume | 128 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2165648 | |
journal fristpage | 98 | |
identifier eissn | 1043-7398 | |
keywords | Electronic packaging | |
keywords | Shapes AND Solder joints | |
tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001 | |
contenttype | Fulltext | |