| contributor author | Mudasir Ahmad | |
| contributor author | Ken Hubbard | |
| contributor author | Mason Hu | |
| date accessioned | 2017-05-09T00:19:37Z | |
| date available | 2017-05-09T00:19:37Z | |
| date copyright | March, 2006 | |
| date issued | 2006 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26259#98_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133550 | |
| description abstract | Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298] | |
| type | Journal Paper | |
| journal volume | 128 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2165648 | |
| journal fristpage | 98 | |
| identifier eissn | 1043-7398 | |
| keywords | Electronic packaging | |
| keywords | Shapes AND Solder joints | |
| tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001 | |
| contenttype | Fulltext | |