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contributor authorRodrigo Escobar
contributor authorBrian Smith
contributor authorCristina Amon
date accessioned2017-05-09T00:19:36Z
date available2017-05-09T00:19:36Z
date copyrightJune, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26263#115_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133540
description abstractNumerical simulations of time-dependent energy transport in semiconductor thin films are performed using the lattice Boltzmann method applied to phonon transport. The discrete lattice Boltzmann method is derived from the continuous Boltzmann transport equation assuming first gray dispersion and then nonlinear, frequency-dependent phonon dispersion for acoustic and optical phonons. Results indicate that a transition from diffusive to ballistic energy transport is found as the characteristic length of the system becomes comparable to the phonon mean free path. The methodology is used in representative microelectronics applications covering both crystalline and amorphous materials including silicon thin films and nanoporous silica dielectrics. Size-dependent thermal conductivity values are also computed based on steady-state temperature distributions obtained from the numerical models. For each case, reducing feature size into the subcontinuum regime decreases the thermal conductivity when compared to bulk values. Overall, simulations that consider phonon dispersion yield results more consistent with experimental correlations.
publisherThe American Society of Mechanical Engineers (ASME)
titleLattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
typeJournal Paper
journal volume128
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2188951
journal fristpage115
journal lastpage124
identifier eissn1043-7398
keywordsThin films
keywordsTemperature
keywordsPhonons
keywordsThermal conductivity
keywordsSilicon
keywordsLattice Boltzmann methods
keywordsConductivity
keywordsMicroelectronic devices
keywordsEquations AND Modeling
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002
contenttypeFulltext


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