Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network ModulesSource: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003::page 236Author:Bivragh Majeed
,
Kieran Delaney
,
John Barton
,
Niall McCarthy
,
Sean C. O’Mathuna
,
John Alderman
DOI: 10.1115/1.2229221Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes.
keyword(s): Copper , Stress , Stiffness , Thickness , Wireless sensor networks , Manufacturing , Semiconductor wafers , Packaging , Lasers , Polymers , Circuits , Etching , Sputtering (Irradiation) , Elasticity AND Electric potential ,
|
Collections
Show full item record
contributor author | Bivragh Majeed | |
contributor author | Kieran Delaney | |
contributor author | John Barton | |
contributor author | Niall McCarthy | |
contributor author | Sean C. O’Mathuna | |
contributor author | John Alderman | |
date accessioned | 2017-05-09T00:19:34Z | |
date available | 2017-05-09T00:19:34Z | |
date copyright | September, 2006 | |
date issued | 2006 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26264#236_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133525 | |
description abstract | In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules | |
type | Journal Paper | |
journal volume | 128 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2229221 | |
journal fristpage | 236 | |
journal lastpage | 245 | |
identifier eissn | 1043-7398 | |
keywords | Copper | |
keywords | Stress | |
keywords | Stiffness | |
keywords | Thickness | |
keywords | Wireless sensor networks | |
keywords | Manufacturing | |
keywords | Semiconductor wafers | |
keywords | Packaging | |
keywords | Lasers | |
keywords | Polymers | |
keywords | Circuits | |
keywords | Etching | |
keywords | Sputtering (Irradiation) | |
keywords | Elasticity AND Electric potential | |
tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003 | |
contenttype | Fulltext |