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    Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 466
    Author:
    Tunc Icoz
    ,
    Nitin Verma
    ,
    Yogesh Jaluria
    DOI: 10.1115/1.2353284
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and more efficient design and optimization methodologies are required. Conventional approaches are based on sequential use of numerical simulation and experiment. Thus, they fail to use certain advantages of using both tools concurrently. The present study is aimed at combining simulation and experiment in a concurrent manner such that outputs of each approach drive the other to achieve better engineering design in a more efficient way. In this study, a relatively simple problem, involving heat transfer from multiple heat sources simulating electronic components and located in a horizontal channel, was investigated. Two experimental setups were fabricated for air and liquid cooling experiments to study the effects of different coolants. De-ionized water was used as the liquid coolant in one case and air in the other. The effects of separation distance and flow conditions on the heat transfer and on the fluid flow characteristics were investigated in detail for both coolants. Cooling capabilities of different cooling arrangements were compared and the results from simulations and experiments were combined to create response surfaces and to find the optimal values of the design parameters.
    keyword(s): Flow (Dynamics) , Heat , Heat transfer , Cooling , Design , Computer simulation , Optimization , Channels (Hydraulic engineering) , Simulation , Cooling systems , Electronic components , Pressure drop , Separation (Technology) AND Water ,
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      Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

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    http://yetl.yabesh.ir/yetl1/handle/yetl/133514
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    contributor authorTunc Icoz
    contributor authorNitin Verma
    contributor authorYogesh Jaluria
    date accessioned2017-05-09T00:19:33Z
    date available2017-05-09T00:19:33Z
    date copyrightDecember, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26266#466_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133514
    description abstractThe design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and more efficient design and optimization methodologies are required. Conventional approaches are based on sequential use of numerical simulation and experiment. Thus, they fail to use certain advantages of using both tools concurrently. The present study is aimed at combining simulation and experiment in a concurrent manner such that outputs of each approach drive the other to achieve better engineering design in a more efficient way. In this study, a relatively simple problem, involving heat transfer from multiple heat sources simulating electronic components and located in a horizontal channel, was investigated. Two experimental setups were fabricated for air and liquid cooling experiments to study the effects of different coolants. De-ionized water was used as the liquid coolant in one case and air in the other. The effects of separation distance and flow conditions on the heat transfer and on the fluid flow characteristics were investigated in detail for both coolants. Cooling capabilities of different cooling arrangements were compared and the results from simulations and experiments were combined to create response surfaces and to find the optimal values of the design parameters.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
    typeJournal Paper
    journal volume128
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2353284
    journal fristpage466
    journal lastpage478
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat
    keywordsHeat transfer
    keywordsCooling
    keywordsDesign
    keywordsComputer simulation
    keywordsOptimization
    keywordsChannels (Hydraulic engineering)
    keywordsSimulation
    keywordsCooling systems
    keywordsElectronic components
    keywordsPressure drop
    keywordsSeparation (Technology) AND Water
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
    contenttypeFulltext
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    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian