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    Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 449
    Author:
    Kun-Nan Chen
    DOI: 10.1115/1.2353281
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the design of printed circuit boards (PCBs), it is preferable to increase their fundamental frequency so as to reduce the effects of the dynamic loading on them. The dynamic characteristics of a PCB carrying various electronic components and modules are most significantly affected by the geometrical and material properties of the bare board and by the boundary conditions supporting the loaded PCB. In this research, a PCB carrying a heavy CPU cooling fan and supported by six fastening screws is investigated by the modal testing and analyzed by the finite element method. After the finite element model of the PCB is verified by the experimental results, the locations of the six supporting screws are optimized to achieve a maximum fundamental frequency for the loaded PCB. The position of each fastening screw can be determined by two design variables, i.e., x and y coordinates. Two cases are studied: the symmetric case (six design parameters) with the symmetric constraint on the support locations imposed, and the asymmetric case (12 design parameters) without the constraint imposed. Finally, verification experiments are performed on the two PCBs supported by screws located at the optimal positions. Although relatively large differences between the calculated, optimized fundamental frequencies and the experimental values are observed, the experiments confirm a very significant improvement in frequency for both cases.
    keyword(s): Materials properties , Design , Electronic components , Finite element analysis , Optimization , Testing , Boundary-value problems , Finite element model , Frequency , Computer cooling , Printed circuit boards , Screws , Finite element methods , Cooling AND Dynamic testing (Materials) ,
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      Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

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    contributor authorKun-Nan Chen
    date accessioned2017-05-09T00:19:33Z
    date available2017-05-09T00:19:33Z
    date copyrightDecember, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26266#449_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133511
    description abstractIn the design of printed circuit boards (PCBs), it is preferable to increase their fundamental frequency so as to reduce the effects of the dynamic loading on them. The dynamic characteristics of a PCB carrying various electronic components and modules are most significantly affected by the geometrical and material properties of the bare board and by the boundary conditions supporting the loaded PCB. In this research, a PCB carrying a heavy CPU cooling fan and supported by six fastening screws is investigated by the modal testing and analyzed by the finite element method. After the finite element model of the PCB is verified by the experimental results, the locations of the six supporting screws are optimized to achieve a maximum fundamental frequency for the loaded PCB. The position of each fastening screw can be determined by two design variables, i.e., x and y coordinates. Two cases are studied: the symmetric case (six design parameters) with the symmetric constraint on the support locations imposed, and the asymmetric case (12 design parameters) without the constraint imposed. Finally, verification experiments are performed on the two PCBs supported by screws located at the optimal positions. Although relatively large differences between the calculated, optimized fundamental frequencies and the experimental values are observed, the experiments confirm a very significant improvement in frequency for both cases.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOptimal Support Locations for a Printed Circuit Board Loaded With Heavy Components
    typeJournal Paper
    journal volume128
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2353281
    journal fristpage449
    journal lastpage455
    identifier eissn1043-7398
    keywordsMaterials properties
    keywordsDesign
    keywordsElectronic components
    keywordsFinite element analysis
    keywordsOptimization
    keywordsTesting
    keywordsBoundary-value problems
    keywordsFinite element model
    keywordsFrequency
    keywordsComputer cooling
    keywordsPrinted circuit boards
    keywordsScrews
    keywordsFinite element methods
    keywordsCooling AND Dynamic testing (Materials)
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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