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    Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 319
    Author:
    Zongrong Liu
    ,
    D. D. Chung
    DOI: 10.1115/1.2351895
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Wax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5–11μm) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from 22to48°C, but increased with increasing temperature from 48to55°C. The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2vol.%, but decreased upon further increase to 8.6vol.%. The highest conductance above the melting temperature was 18×104W∕m2.°C, as attained for a BN content of 4.0vol.% at 55°C and 0.30MPa. Below the melting temperature, the highest conductance was 19×104W∕m2.°C, as attained for a BN content of 6.2vol.% at 22°C and 0.30MPa.
    keyword(s): Pressure , Temperature , Particulate matter , Paraffin wax , Contact resistance , Electrical conductance , Copper AND Melting ,
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      Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

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    http://yetl.yabesh.ir/yetl1/handle/yetl/133492
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    contributor authorZongrong Liu
    contributor authorD. D. Chung
    date accessioned2017-05-09T00:19:30Z
    date available2017-05-09T00:19:30Z
    date copyrightDecember, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26266#319_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133492
    description abstractWax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5–11μm) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from 22to48°C, but increased with increasing temperature from 48to55°C. The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2vol.%, but decreased upon further increase to 8.6vol.%. The highest conductance above the melting temperature was 18×104W∕m2.°C, as attained for a BN content of 4.0vol.% at 55°C and 0.30MPa. Below the melting temperature, the highest conductance was 19×104W∕m2.°C, as attained for a BN content of 6.2vol.% at 22°C and 0.30MPa.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleBoron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material
    typeJournal Paper
    journal volume128
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2351895
    journal fristpage319
    journal lastpage323
    identifier eissn1043-7398
    keywordsPressure
    keywordsTemperature
    keywordsParticulate matter
    keywordsParaffin wax
    keywordsContact resistance
    keywordsElectrical conductance
    keywordsCopper AND Melting
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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