Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface MaterialSource: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 319DOI: 10.1115/1.2351895Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5–11μm) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from 22to48°C, but increased with increasing temperature from 48to55°C. The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2vol.%, but decreased upon further increase to 8.6vol.%. The highest conductance above the melting temperature was 18×104W∕m2.°C, as attained for a BN content of 4.0vol.% at 55°C and 0.30MPa. Below the melting temperature, the highest conductance was 19×104W∕m2.°C, as attained for a BN content of 6.2vol.% at 22°C and 0.30MPa.
keyword(s): Pressure , Temperature , Particulate matter , Paraffin wax , Contact resistance , Electrical conductance , Copper AND Melting ,
|
Collections
Show full item record
| contributor author | Zongrong Liu | |
| contributor author | D. D. Chung | |
| date accessioned | 2017-05-09T00:19:30Z | |
| date available | 2017-05-09T00:19:30Z | |
| date copyright | December, 2006 | |
| date issued | 2006 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26266#319_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133492 | |
| description abstract | Wax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5–11μm) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from 22to48°C, but increased with increasing temperature from 48to55°C. The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2vol.%, but decreased upon further increase to 8.6vol.%. The highest conductance above the melting temperature was 18×104W∕m2.°C, as attained for a BN content of 4.0vol.% at 55°C and 0.30MPa. Below the melting temperature, the highest conductance was 19×104W∕m2.°C, as attained for a BN content of 6.2vol.% at 22°C and 0.30MPa. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material | |
| type | Journal Paper | |
| journal volume | 128 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2351895 | |
| journal fristpage | 319 | |
| journal lastpage | 323 | |
| identifier eissn | 1043-7398 | |
| keywords | Pressure | |
| keywords | Temperature | |
| keywords | Particulate matter | |
| keywords | Paraffin wax | |
| keywords | Contact resistance | |
| keywords | Electrical conductance | |
| keywords | Copper AND Melting | |
| tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004 | |
| contenttype | Fulltext |