| contributor author | Xiaomei Yu | |
| contributor author | Ting Li | |
| contributor author | Lin Hao | |
| contributor author | Dacheng Zhang | |
| date accessioned | 2017-05-09T00:15:54Z | |
| date available | 2017-05-09T00:15:54Z | |
| date copyright | March, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26242#38_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131670 | |
| description abstract | A polymerase chain reaction (PCR) microchip array with a dimension of 21.3×17.5 mm2 has been fabricated by the silicon micromachining technique. The chip is composed of 192 rectangular reaction chambers with the volume of 50 nL. In order to package the silicon-based PCR chip, a low-temperature bonding technique using polymers as the intermediate layers has been developed. The tested polymers include positive photoresist, polyimide, and epoxy. Using stamping and sandwich techniques, void-free and liquid-proof bondings of silicon to a glass cover were achieved with the three polymers. The experimental results of fluorescence-based PCR demonstrate that the DNA amplification can be performed in the chip arrays with nanoliter volumes and the polymer bonding technique is biocompatible and suitable for the microchip packaging. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | PCR Microchip Array Based on Polymer Bonding Technique | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1849231 | |
| journal fristpage | 38 | |
| journal lastpage | 42 | |
| identifier eissn | 1043-7398 | |
| keywords | Fluorescence | |
| keywords | Bonding | |
| keywords | Polymers | |
| keywords | Integrated circuits | |
| keywords | Packaging | |
| keywords | DNA | |
| keywords | Glass | |
| keywords | Photoresists | |
| keywords | Low temperature | |
| keywords | Silicon | |
| keywords | Metal stamping | |
| keywords | Epoxy adhesives | |
| keywords | Biocompatibility | |
| keywords | Silicon chips AND Temperature | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001 | |
| contenttype | Fulltext | |