contributor author | Xiaomei Yu | |
contributor author | Ting Li | |
contributor author | Lin Hao | |
contributor author | Dacheng Zhang | |
date accessioned | 2017-05-09T00:15:54Z | |
date available | 2017-05-09T00:15:54Z | |
date copyright | March, 2005 | |
date issued | 2005 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26242#38_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131670 | |
description abstract | A polymerase chain reaction (PCR) microchip array with a dimension of 21.3×17.5 mm2 has been fabricated by the silicon micromachining technique. The chip is composed of 192 rectangular reaction chambers with the volume of 50 nL. In order to package the silicon-based PCR chip, a low-temperature bonding technique using polymers as the intermediate layers has been developed. The tested polymers include positive photoresist, polyimide, and epoxy. Using stamping and sandwich techniques, void-free and liquid-proof bondings of silicon to a glass cover were achieved with the three polymers. The experimental results of fluorescence-based PCR demonstrate that the DNA amplification can be performed in the chip arrays with nanoliter volumes and the polymer bonding technique is biocompatible and suitable for the microchip packaging. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | PCR Microchip Array Based on Polymer Bonding Technique | |
type | Journal Paper | |
journal volume | 127 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1849231 | |
journal fristpage | 38 | |
journal lastpage | 42 | |
identifier eissn | 1043-7398 | |
keywords | Fluorescence | |
keywords | Bonding | |
keywords | Polymers | |
keywords | Integrated circuits | |
keywords | Packaging | |
keywords | DNA | |
keywords | Glass | |
keywords | Photoresists | |
keywords | Low temperature | |
keywords | Silicon | |
keywords | Metal stamping | |
keywords | Epoxy adhesives | |
keywords | Biocompatibility | |
keywords | Silicon chips AND Temperature | |
tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001 | |
contenttype | Fulltext | |