A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package ManufacturingSource: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001::page 1Author:K.-F. Becker
,
T. Braun
,
A. Neumann
,
A. Ostmann
,
E. Coko
,
M. Koch
,
V. Bader
,
R. Aschenbrenner
,
H. Reichl
DOI: 10.1115/1.1846058Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the general trends in microelectronics packaging is the constant miniaturization of devices. This has led to the development of maximum miniaturization of components on Si level, i.e., CSPs and Flip Chips. To further integrate more functionality into devices, and to further increase the degree of miniaturization, packaging development focus is switching from single chip packaging to the realization of systems in package, SiPs. Two main approaches do exist to realize this goal: one is to integrate all components into one dedicated package, yielding maximum miniaturization for a special application, but little flexibility as far as system design is concerned. The other is to create modular stackable components that can be assembled into a functional system. This integrates both flexibility in system design by exchangeable components and increased reliability potential, as single components can be tested separately. This last approach was considered a promising choice for the generation of SiPs. Within this paper a packaging process is introduced that allows the wafer level manufacturing of stackable, encapsulated devices. Using a transfer molded epoxy demonstrator, a proof-of-concept is performed showing the feasibility of the stackable package approach. This is achieved by combining wafer level encapsulation and molded interconnect device technology. An electroless process for metallization and laser techniques for structuring the metallization layer have been applied to generate structures for reliable interconnects capable for the use of lead-free solders. Summarized, this paper presents the process development and feasibility analysis of wafer level packaging technologies for modular SiP solutions based on a duromer MID approach.
keyword(s): Lasers , Manufacturing , Semiconductor wafers , Packaging , System-in-package , Reliability AND Flow (Dynamics) ,
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contributor author | K.-F. Becker | |
contributor author | T. Braun | |
contributor author | A. Neumann | |
contributor author | A. Ostmann | |
contributor author | E. Coko | |
contributor author | M. Koch | |
contributor author | V. Bader | |
contributor author | R. Aschenbrenner | |
contributor author | H. Reichl | |
date accessioned | 2017-05-09T00:15:54Z | |
date available | 2017-05-09T00:15:54Z | |
date copyright | March, 2005 | |
date issued | 2005 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26242#1_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131662 | |
description abstract | One of the general trends in microelectronics packaging is the constant miniaturization of devices. This has led to the development of maximum miniaturization of components on Si level, i.e., CSPs and Flip Chips. To further integrate more functionality into devices, and to further increase the degree of miniaturization, packaging development focus is switching from single chip packaging to the realization of systems in package, SiPs. Two main approaches do exist to realize this goal: one is to integrate all components into one dedicated package, yielding maximum miniaturization for a special application, but little flexibility as far as system design is concerned. The other is to create modular stackable components that can be assembled into a functional system. This integrates both flexibility in system design by exchangeable components and increased reliability potential, as single components can be tested separately. This last approach was considered a promising choice for the generation of SiPs. Within this paper a packaging process is introduced that allows the wafer level manufacturing of stackable, encapsulated devices. Using a transfer molded epoxy demonstrator, a proof-of-concept is performed showing the feasibility of the stackable package approach. This is achieved by combining wafer level encapsulation and molded interconnect device technology. An electroless process for metallization and laser techniques for structuring the metallization layer have been applied to generate structures for reliable interconnects capable for the use of lead-free solders. Summarized, this paper presents the process development and feasibility analysis of wafer level packaging technologies for modular SiP solutions based on a duromer MID approach. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing | |
type | Journal Paper | |
journal volume | 127 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1846058 | |
journal fristpage | 1 | |
journal lastpage | 6 | |
identifier eissn | 1043-7398 | |
keywords | Lasers | |
keywords | Manufacturing | |
keywords | Semiconductor wafers | |
keywords | Packaging | |
keywords | System-in-package | |
keywords | Reliability AND Flow (Dynamics) | |
tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001 | |
contenttype | Fulltext |