| contributor author | X. K. Sun | |
| contributor author | Z. J. Pei | |
| contributor author | X. J. Xin | |
| date accessioned | 2017-05-09T00:15:54Z | |
| date available | 2017-05-09T00:15:54Z | |
| date copyright | June, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26243#189_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131661 | |
| description abstract | This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates a uniform stress field on a large die surface area. The four-point-bend configuration ranks second and the three-point-bend configuration is third. The pin-on-ring configuration is the worst because the stress gradient is severe in the central region. To minimize uncertainty in the loading positions, it is advised that loading rings or bars with small radii be used. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1869510 | |
| journal fristpage | 189 | |
| journal lastpage | 192 | |
| identifier eissn | 1043-7398 | |
| keywords | Semiconductor wafers | |
| keywords | Stress | |
| keywords | Finite element analysis | |
| keywords | Testing AND Fracture (Process) | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002 | |
| contenttype | Fulltext | |