| contributor author | X. J. Fan | |
| contributor author | J. Zhou | |
| contributor author | G. Q. Zhang | |
| contributor author | L. J. Ernst | |
| date accessioned | 2017-05-09T00:15:51Z | |
| date available | 2017-05-09T00:15:51Z | |
| date copyright | September, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26247#262_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131629 | |
| description abstract | A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected to the interfaces after the delamination. The impact of the vapor pressure induced expanison on the material’s deformation is discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Micromechanics-Based Vapor Pressure Model in Electronic Packages | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1939027 | |
| journal fristpage | 262 | |
| journal lastpage | 267 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003 | |
| contenttype | Fulltext | |