contributor author | K. M. Jansen | |
contributor author | H. J. Bressers | |
contributor author | G. Q. Zhang | |
contributor author | V. Gonda | |
contributor author | L. J. Ernst | |
date accessioned | 2017-05-09T00:15:50Z | |
date available | 2017-05-09T00:15:50Z | |
date copyright | December, 2005 | |
date issued | 2005 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26254#530_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131618 | |
description abstract | In microelectronic industry, thin polymer layers are one of the more commonly used product constituents. Examples are glue layers, coatings, and dielectric layers. The thicknesses of these films vary from a few tens of nanometers to over a hundred micrometers. Since at film thicknesses below 100nm the thermal and mechanical properties start to deviate from those in the bulk, adequate characterization techniques are required. In the present paper we will report the results of an extensive literature search on the state-of-the-art of thermo-mechanical thin film characterization methods, such as the substrate curvature test, nanoindentation technique, bulge test, and impulsive stimulated thermal scattering. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films | |
type | Journal Paper | |
journal volume | 127 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2070092 | |
journal fristpage | 530 | |
journal lastpage | 536 | |
identifier eissn | 1043-7398 | |
keywords | Thin films | |
keywords | Elasticity | |
keywords | Stress | |
keywords | Radiation scattering | |
keywords | Electromagnetic scattering | |
keywords | Polymers | |
keywords | Errors | |
keywords | Film thickness | |
keywords | Nanoindentation | |
keywords | Polymer films | |
keywords | Deflection | |
keywords | Thickness | |
keywords | Lasers | |
keywords | Mechanical properties | |
keywords | Acoustics | |
keywords | Testing | |
keywords | Coatings | |
keywords | Displacement | |
keywords | Temperature | |
keywords | Pressure AND Shapes | |
tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004 | |
contenttype | Fulltext | |