| contributor author | Yutaka Tsukada | |
| contributor author | Hideo Nishimura | |
| contributor author | Hiroki Yamamoto | |
| contributor author | Masao Sakane | |
| date accessioned | 2017-05-09T00:15:49Z | |
| date available | 2017-05-09T00:15:49Z | |
| date copyright | December, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26254#407_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131602 | |
| description abstract | This paper studies creep-fatigue life prediction under shear loading by making extensive torsion creep-fatigue experiments using four kinds of strain waves. The linear damage rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model were applied to the experimental data, but no methods accurately predicted the creep-fatigue life. A new method based on the strain rate ratio, which predicted the creep-fatigue life within a factor of 4 scatter band, was developed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2070091 | |
| journal fristpage | 407 | |
| journal lastpage | 414 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Fatigue | |
| keywords | Solders | |
| keywords | Fatigue life | |
| keywords | Shear (Mechanics) AND Waves | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004 | |
| contenttype | Fulltext | |