Design Optimization for Pin-Fin Heat SinksSource: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004::page 397DOI: 10.1115/1.2056572Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. This study shows how automated design optimization techniques can be successfully applied to optimal design of pin-fin heat sinks, which allows the thermal engineer to meet several design objectives and constraints simultaneously. The thermal and hydrodynamic models for pin-fin heat sinks have been developed. A statistical method for sensitivity analysis of the design factors, including the size of heat source and sink footprint, conductivity of sink base, fin material, fin pitch, fin diameter, fin height, thickness of sink base, and upstream mass flowrate, is performed to determine the key factors that are critical to the design. A response surface methodology is then applied to establish regression models for the thermal resistance and pressure drop in terms of the design factors with an experimental design. By employing the gradient-based numerical optimization technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations and numerical simulations are made with satisfactory agreements.
keyword(s): Design , Optimization , Heat sinks , Pressure drop , Response surface methodology , Heat AND Thermal resistance ,
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| contributor author | Han-Ting Chen | |
| contributor author | Ying-Huei Hung | |
| contributor author | Po-Li Chen | |
| contributor author | Jenn-Tsong Horng | |
| date accessioned | 2017-05-09T00:15:49Z | |
| date available | 2017-05-09T00:15:49Z | |
| date copyright | December, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26254#397_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131600 | |
| description abstract | An effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. This study shows how automated design optimization techniques can be successfully applied to optimal design of pin-fin heat sinks, which allows the thermal engineer to meet several design objectives and constraints simultaneously. The thermal and hydrodynamic models for pin-fin heat sinks have been developed. A statistical method for sensitivity analysis of the design factors, including the size of heat source and sink footprint, conductivity of sink base, fin material, fin pitch, fin diameter, fin height, thickness of sink base, and upstream mass flowrate, is performed to determine the key factors that are critical to the design. A response surface methodology is then applied to establish regression models for the thermal resistance and pressure drop in terms of the design factors with an experimental design. By employing the gradient-based numerical optimization technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations and numerical simulations are made with satisfactory agreements. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Design Optimization for Pin-Fin Heat Sinks | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2056572 | |
| journal fristpage | 397 | |
| journal lastpage | 406 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Optimization | |
| keywords | Heat sinks | |
| keywords | Pressure drop | |
| keywords | Response surface methodology | |
| keywords | Heat AND Thermal resistance | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004 | |
| contenttype | Fulltext |