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    Design Optimization for Pin-Fin Heat Sinks

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004::page 397
    Author:
    Han-Ting Chen
    ,
    Ying-Huei Hung
    ,
    Po-Li Chen
    ,
    Jenn-Tsong Horng
    DOI: 10.1115/1.2056572
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. This study shows how automated design optimization techniques can be successfully applied to optimal design of pin-fin heat sinks, which allows the thermal engineer to meet several design objectives and constraints simultaneously. The thermal and hydrodynamic models for pin-fin heat sinks have been developed. A statistical method for sensitivity analysis of the design factors, including the size of heat source and sink footprint, conductivity of sink base, fin material, fin pitch, fin diameter, fin height, thickness of sink base, and upstream mass flowrate, is performed to determine the key factors that are critical to the design. A response surface methodology is then applied to establish regression models for the thermal resistance and pressure drop in terms of the design factors with an experimental design. By employing the gradient-based numerical optimization technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations and numerical simulations are made with satisfactory agreements.
    keyword(s): Design , Optimization , Heat sinks , Pressure drop , Response surface methodology , Heat AND Thermal resistance ,
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      Design Optimization for Pin-Fin Heat Sinks

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    http://yetl.yabesh.ir/yetl1/handle/yetl/131600
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    • Journal of Electronic Packaging

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    contributor authorHan-Ting Chen
    contributor authorYing-Huei Hung
    contributor authorPo-Li Chen
    contributor authorJenn-Tsong Horng
    date accessioned2017-05-09T00:15:49Z
    date available2017-05-09T00:15:49Z
    date copyrightDecember, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26254#397_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131600
    description abstractAn effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. This study shows how automated design optimization techniques can be successfully applied to optimal design of pin-fin heat sinks, which allows the thermal engineer to meet several design objectives and constraints simultaneously. The thermal and hydrodynamic models for pin-fin heat sinks have been developed. A statistical method for sensitivity analysis of the design factors, including the size of heat source and sink footprint, conductivity of sink base, fin material, fin pitch, fin diameter, fin height, thickness of sink base, and upstream mass flowrate, is performed to determine the key factors that are critical to the design. A response surface methodology is then applied to establish regression models for the thermal resistance and pressure drop in terms of the design factors with an experimental design. By employing the gradient-based numerical optimization technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations and numerical simulations are made with satisfactory agreements.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign Optimization for Pin-Fin Heat Sinks
    typeJournal Paper
    journal volume127
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2056572
    journal fristpage397
    journal lastpage406
    identifier eissn1043-7398
    keywordsDesign
    keywordsOptimization
    keywordsHeat sinks
    keywordsPressure drop
    keywordsResponse surface methodology
    keywordsHeat AND Thermal resistance
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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