| contributor author | Steven Murray | |
| contributor author | Craig Hillman | |
| contributor author | Michael Pecht | |
| date accessioned | 2017-05-09T00:12:43Z | |
| date available | 2017-05-09T00:12:43Z | |
| date copyright | September, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26235#390_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129861 | |
| description abstract | One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper, the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion is then proposed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Environmental Aging and Deadhesion of Polyimide Dielectric Films | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1773853 | |
| journal fristpage | 390 | |
| journal lastpage | 397 | |
| identifier eissn | 1043-7398 | |
| keywords | Thin films | |
| keywords | Temperature | |
| keywords | Stress | |
| keywords | Fatigue | |
| keywords | Mechanisms | |
| keywords | Metals | |
| keywords | Polymers | |
| keywords | Equations AND Design | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003 | |
| contenttype | Fulltext | |