| contributor author | D. J. de Kock | |
| contributor author | J. A. Visser | |
| date accessioned | 2017-05-09T00:12:42Z | |
| date available | 2017-05-09T00:12:42Z | |
| date copyright | September, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26235#333_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129853 | |
| description abstract | Heat sink designers have to balance a number of conflicting parameters to maximize the performance of heat sinks. This multi-parameter problem lends itself naturally to mathematical optimization techniques. The paper illustrates how mathematical optimization techniques combined with a semi-empirical thermal simulation program can be used to construct a trade-off curve (Pareto-optimal set) between the heat sink mass and thermal resistance for a given heat sink configuration. This trade-off curve can be used by the engineer to decide on the optimal heat sink design that is the best compromise between heat sink mass and thermal resistance for the specific application under consideration. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1772414 | |
| journal fristpage | 333 | |
| journal lastpage | 341 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Optimization | |
| keywords | Heat sinks AND Thermal resistance | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003 | |
| contenttype | Fulltext | |