The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly PackagingSource: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003::page 273Author:Samuel I-En Lin
DOI: 10.1115/1.1756592Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs for the metal tube with 0.1 mm alignment offset. It was found that 6-solder joint requires more thermal cycles to arrive a stable tilt angle. The transverse movement of metal tube under thermal loading was also examined to determine the influence of solder volume imperfections and solder materials. Favorable results were obtained for 80Au20Sn solder as compared to 63Sn37Pb solder. From the thermal-elasto-plastic analysis, the solder volume control has great impact on the metal tube movement and tilt angle during thermal loadings. If adequate solder volume is provided in four solder joints, the minimum alignment shift of the metal tube is projected to be comparable to an optimally designed bond joint geometry.
keyword(s): Metals , Solders , Manufacturing , Thin films , Cycles , Packaging , Mechanisms AND Deformation ,
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| contributor author | Samuel I-En Lin | |
| date accessioned | 2017-05-09T00:12:42Z | |
| date available | 2017-05-09T00:12:42Z | |
| date copyright | September, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26235#273_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129846 | |
| description abstract | Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs for the metal tube with 0.1 mm alignment offset. It was found that 6-solder joint requires more thermal cycles to arrive a stable tilt angle. The transverse movement of metal tube under thermal loading was also examined to determine the influence of solder volume imperfections and solder materials. Favorable results were obtained for 80Au20Sn solder as compared to 63Sn37Pb solder. From the thermal-elasto-plastic analysis, the solder volume control has great impact on the metal tube movement and tilt angle during thermal loadings. If adequate solder volume is provided in four solder joints, the minimum alignment shift of the metal tube is projected to be comparable to an optimally designed bond joint geometry. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1756592 | |
| journal fristpage | 273 | |
| journal lastpage | 281 | |
| identifier eissn | 1043-7398 | |
| keywords | Metals | |
| keywords | Solders | |
| keywords | Manufacturing | |
| keywords | Thin films | |
| keywords | Cycles | |
| keywords | Packaging | |
| keywords | Mechanisms AND Deformation | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003 | |
| contenttype | Fulltext |