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    The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003::page 273
    Author:
    Samuel I-En Lin
    DOI: 10.1115/1.1756592
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs for the metal tube with 0.1 mm alignment offset. It was found that 6-solder joint requires more thermal cycles to arrive a stable tilt angle. The transverse movement of metal tube under thermal loading was also examined to determine the influence of solder volume imperfections and solder materials. Favorable results were obtained for 80Au20Sn solder as compared to 63Sn37Pb solder. From the thermal-elasto-plastic analysis, the solder volume control has great impact on the metal tube movement and tilt angle during thermal loadings. If adequate solder volume is provided in four solder joints, the minimum alignment shift of the metal tube is projected to be comparable to an optimally designed bond joint geometry.
    keyword(s): Metals , Solders , Manufacturing , Thin films , Cycles , Packaging , Mechanisms AND Deformation ,
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      The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

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    http://yetl.yabesh.ir/yetl1/handle/yetl/129846
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    contributor authorSamuel I-En Lin
    date accessioned2017-05-09T00:12:42Z
    date available2017-05-09T00:12:42Z
    date copyrightSeptember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26235#273_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129846
    description abstractThermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs for the metal tube with 0.1 mm alignment offset. It was found that 6-solder joint requires more thermal cycles to arrive a stable tilt angle. The transverse movement of metal tube under thermal loading was also examined to determine the influence of solder volume imperfections and solder materials. Favorable results were obtained for 80Au20Sn solder as compared to 63Sn37Pb solder. From the thermal-elasto-plastic analysis, the solder volume control has great impact on the metal tube movement and tilt angle during thermal loadings. If adequate solder volume is provided in four solder joints, the minimum alignment shift of the metal tube is projected to be comparable to an optimally designed bond joint geometry.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging
    typeJournal Paper
    journal volume126
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1756592
    journal fristpage273
    journal lastpage281
    identifier eissn1043-7398
    keywordsMetals
    keywordsSolders
    keywordsManufacturing
    keywordsThin films
    keywordsCycles
    keywordsPackaging
    keywordsMechanisms AND Deformation
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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