| contributor author | S. B. Sathe | |
| contributor author | B. G. Sammakia | |
| date accessioned | 2017-05-09T00:12:41Z | |
| date available | 2017-05-09T00:12:41Z | |
| date copyright | December, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26239#528_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129838 | |
| description abstract | The results of a study of a new and unique high-performance air-cooled impingement heat sink are presented. An extensive numerical investigation of the heat sink performance is conducted and is verified by experimental data. The study is relevant to cooling of high-power chips and modules in air-cooled environments and applies to workstations or mainframes. In the study, a rectangular jet impinges on a set of parallel fins and then turns into cross flow. The effects of the fin thickness, gap nozzle width and fin shape on the heat transfer and pressure drop are investigated. It is found that pressure drop is reduced by cutting the fins in the central impingement zone without sacrificing the heat transfer due to a reduction in the extent of the stagnant zone. A combination of fin thicknesses of the order of 0.5 mm and channel gaps of 0.8 mm with appropriate central cutout yielded heat transfer coefficients over 1500 W/m2 K at a pressure drop of less than 100 N/m2 , as is typically available in high-end workstations. A detailed study of flow-through heat sinks subject to the same constraints as the impingement heat sink showed that the flow-through heat sink could not achieve the high heat transfer coefficients at a low pressure drop. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | An Analytical Study of the Optimized Performance of an Impingement Heat Sink | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1827269 | |
| journal fristpage | 528 | |
| journal lastpage | 534 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Fins | |
| keywords | Heat sinks | |
| keywords | Pressure drop | |
| keywords | Flow (Dynamics) | |
| keywords | Heat transfer | |
| keywords | Channels (Hydraulic engineering) AND Thickness | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004 | |
| contenttype | Fulltext | |