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    Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 457
    Author:
    Brian H. Dennis
    ,
    Zhen-xue Han
    ,
    George S. Dulikravich
    DOI: 10.1115/1.1827261
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element method (FEM) formulation for the prediction of unknown steady boundary conditions in heat conduction for multidomain three-dimensional (3D) solid objects is presented. The FEM formulation is capable of determining temperatures and heat fluxes on the boundaries where such quantities are unknown, provided such quantities are sufficiently overspecified on other boundaries. An inverse finite element program has been previously developed and successfully tested on 3D simple geometries. The finite element code uses an efficient sparse matrix storage scheme that allows treatment of realistic 3D problems on personal computer. The finite element formulation also allows for very straightforward treatment of geometries composed of many different materials. The inverse FEM formulation was applied to the prediction of die-junction temperature distribution in a simple ball grid array electronic package. Examples are presented with simulated measurements, which include random measurement errors. Regularization was applied to control numerical error when large measurement errors were added to the overspecified boundary conditions.
    keyword(s): Heat , Temperature , Heat conduction , Flux (Metallurgy) , Boundary-value problems , Phase interfaces , Electronic components , Errors , Finite element model AND Temperature distribution ,
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      Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/129827
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    contributor authorBrian H. Dennis
    contributor authorZhen-xue Han
    contributor authorGeorge S. Dulikravich
    date accessioned2017-05-09T00:12:40Z
    date available2017-05-09T00:12:40Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#457_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129827
    description abstractA finite element method (FEM) formulation for the prediction of unknown steady boundary conditions in heat conduction for multidomain three-dimensional (3D) solid objects is presented. The FEM formulation is capable of determining temperatures and heat fluxes on the boundaries where such quantities are unknown, provided such quantities are sufficiently overspecified on other boundaries. An inverse finite element program has been previously developed and successfully tested on 3D simple geometries. The finite element code uses an efficient sparse matrix storage scheme that allows treatment of realistic 3D problems on personal computer. The finite element formulation also allows for very straightforward treatment of geometries composed of many different materials. The inverse FEM formulation was applied to the prediction of die-junction temperature distribution in a simple ball grid array electronic package. Examples are presented with simulated measurements, which include random measurement errors. Regularization was applied to control numerical error when large measurement errors were added to the overspecified boundary conditions.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDetermination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1827261
    journal fristpage457
    journal lastpage464
    identifier eissn1043-7398
    keywordsHeat
    keywordsTemperature
    keywordsHeat conduction
    keywordsFlux (Metallurgy)
    keywordsBoundary-value problems
    keywordsPhase interfaces
    keywordsElectronic components
    keywordsErrors
    keywordsFinite element model AND Temperature distribution
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian