contributor author | Yujun Wen | |
contributor author | PhD candidate | |
contributor author | Cemal Basaran | |
contributor author | Assoc. Prof. and Director | |
date accessioned | 2017-05-09T00:09:56Z | |
date available | 2017-05-09T00:09:56Z | |
date copyright | March, 2003 | |
date issued | 2003 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26212#134_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128253 | |
description abstract | An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The theory presented treats each layer as a beam-type plate with orthotropic material properties. As an example, the results are shown for a three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analysis results, as a first order approximation. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging | |
type | Journal Paper | |
journal volume | 125 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1535446 | |
journal fristpage | 134 | |
journal lastpage | 138 | |
identifier eissn | 1043-7398 | |
keywords | Electronic packaging | |
keywords | Stress | |
keywords | Stress analysis (Engineering) | |
keywords | Materials properties | |
keywords | Equations | |
keywords | Finite element analysis | |
keywords | Displacement | |
keywords | Differential equations | |
keywords | Thermal stresses | |
keywords | Design | |
keywords | Shear (Mechanics) | |
keywords | Equilibrium (Physics) | |
keywords | Laminates | |
keywords | Modeling | |
keywords | Numerical analysis | |
keywords | Approximation | |
keywords | Failure | |
keywords | Microelectronic devices AND Delamination | |
tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001 | |
contenttype | Fulltext | |