| contributor author | Yibin Xue | |
| contributor author | Vivek A. Jairazbhoy | |
| contributor author | Xiaoting Niu | |
| contributor author | Jianmin Qu | |
| date accessioned | 2017-05-09T00:09:55Z | |
| date available | 2017-05-09T00:09:55Z | |
| date copyright | March, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26212#53_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128241 | |
| description abstract | Considered in this paper is the large deflection of a thin beam. One end of the beam is fixed (clamped) to a rigid wall, while the other end is placed on a flat surface of arbitrary orientation. Under the assumption that the axial deformation of the neutral axis is negligible, a closed form analytical solution to the deflection curve is obtained in terms of elliptical functions. The analytical solution is shown to have certain scalability properties with respect to the beam length and cross-section. By using appropriate bending rigidity, the same solution can be used for a thin plate under large cylindrical bending. In addition, a finite element analysis using nonlinear shell elements is also conducted showing the axial strain of the neutral axis to be less than one percent of the overall deformation. Therefore, it is valid to assume that the axial strain is negligible. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1527892 | |
| journal fristpage | 53 | |
| journal lastpage | 58 | |
| identifier eissn | 1043-7398 | |
| keywords | Finite element analysis | |
| keywords | Plates (structures) | |
| keywords | Boundary-value problems | |
| keywords | Deflection | |
| keywords | Equations | |
| keywords | Deformation | |
| keywords | Stiffness | |
| keywords | Functions AND Stress | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001 | |
| contenttype | Fulltext | |