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    Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001::page 31
    Author:
    Toru Ikeda
    ,
    Nobutaka Ito
    ,
    Mami Nagatake
    ,
    Isao Arase
    ,
    Yuya Ueno
    ,
    Mitsuru Sato
    ,
    Noriyuki Miyazaki
    DOI: 10.1115/1.1525244
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of the asymptotic solution of a corner of jointed dissimilar materials are utilized for the evaluation of a solder reflow crack in a quad flat package (QFP). First, we estimate the critical vapor pressure, which causes a crack from a corner in the molding resin, using the critical stress intensity factor of a V-notch corner. This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process is estimated. The critical moisture absorption time, which results in crack occurrence during the solder reflow process, can be predicted using this evaluation technique. Furthermore, we perform infrared solder reflow tests of the QFP for verifying the present failure evaluation technique.
    keyword(s): Vapor pressure , Absorption , Stress , Molding resins , Fracture (Materials) , Corners (Structural elements) , Reflow soldering , Finite element model , Displacement AND Fracture toughness ,
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      Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128238
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    • Journal of Electronic Packaging

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    contributor authorToru Ikeda
    contributor authorNobutaka Ito
    contributor authorMami Nagatake
    contributor authorIsao Arase
    contributor authorYuya Ueno
    contributor authorMitsuru Sato
    contributor authorNoriyuki Miyazaki
    date accessioned2017-05-09T00:09:55Z
    date available2017-05-09T00:09:55Z
    date copyrightMarch, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26212#31_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128238
    description abstractA crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of the asymptotic solution of a corner of jointed dissimilar materials are utilized for the evaluation of a solder reflow crack in a quad flat package (QFP). First, we estimate the critical vapor pressure, which causes a crack from a corner in the molding resin, using the critical stress intensity factor of a V-notch corner. This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process is estimated. The critical moisture absorption time, which results in crack occurrence during the solder reflow process, can be predicted using this evaluation technique. Furthermore, we perform infrared solder reflow tests of the QFP for verifying the present failure evaluation technique.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStrength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
    typeJournal Paper
    journal volume125
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1525244
    journal fristpage31
    journal lastpage38
    identifier eissn1043-7398
    keywordsVapor pressure
    keywordsAbsorption
    keywordsStress
    keywordsMolding resins
    keywordsFracture (Materials)
    keywordsCorners (Structural elements)
    keywordsReflow soldering
    keywordsFinite element model
    keywordsDisplacement AND Fracture toughness
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian