| contributor author | Masoud Darbandi | |
| contributor author | Gerry E. Schneider | |
| date accessioned | 2017-05-09T00:09:55Z | |
| date available | 2017-05-09T00:09:55Z | |
| date copyright | June, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26218#244_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128229 | |
| description abstract | The complex nature of the convective terms in the fluid flow governing equations has caused many researchers to work on estimating more accurate advection term magnitudes by employing better approximate expressions. The trend of progress has been to include more physics of flow in the approximations. However, there is no archival evidence that reports the direct implementation of buoyancy as a physical influence in the advection term modeling. In this work, the influence of buoyancy in an efficient advection term expression is investigated in a control volume context with a collocated grid arrangement. The accuracy of the results obtained by both excluding and including the buoyancy term is evaluated through application to the natural convection heat transfer problem in a cavity at different Rayleigh numbers. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1569508 | |
| journal fristpage | 244 | |
| journal lastpage | 250 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Buoyancy | |
| keywords | Heat transfer | |
| keywords | Electronic packaging | |
| keywords | Approximation | |
| keywords | Cavities | |
| keywords | Equations | |
| keywords | Rayleigh number | |
| keywords | Fluid dynamics | |
| keywords | Temperature | |
| keywords | Flux (Metallurgy) | |
| keywords | Natural convection | |
| keywords | Modeling | |
| keywords | Computer simulation AND Physics | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002 | |
| contenttype | Fulltext | |