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    The Case for the Elliptical Spine

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002::page 217
    Author:
    Gerald L. McIntyre
    ,
    Allan D. Kraus
    DOI: 10.1115/1.1569261
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The spine (fin) efficiency is abandoned and the input admittance, defined as the ratio of the heat dissipated by the spine to the temperature excess at the spine base, is established as the parameter for comparison of the performance of the spines of circular, square and elliptical cross section. It is shown that the square cross section outperforms the circular cross section and by adjusting the aspect ratio of the elliptical spine, the spine can meet and eventually surpass the performance of the square spine.
    keyword(s): Heat , Temperature , Metals , Thermal resistance , Flow (Dynamics) AND Heat transfer coefficients ,
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      The Case for the Elliptical Spine

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    http://yetl.yabesh.ir/yetl1/handle/yetl/128225
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    contributor authorGerald L. McIntyre
    contributor authorAllan D. Kraus
    date accessioned2017-05-09T00:09:54Z
    date available2017-05-09T00:09:54Z
    date copyrightJune, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26218#217_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128225
    description abstractThe spine (fin) efficiency is abandoned and the input admittance, defined as the ratio of the heat dissipated by the spine to the temperature excess at the spine base, is established as the parameter for comparison of the performance of the spines of circular, square and elliptical cross section. It is shown that the square cross section outperforms the circular cross section and by adjusting the aspect ratio of the elliptical spine, the spine can meet and eventually surpass the performance of the square spine.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Case for the Elliptical Spine
    typeJournal Paper
    journal volume125
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1569261
    journal fristpage217
    journal lastpage220
    identifier eissn1043-7398
    keywordsHeat
    keywordsTemperature
    keywordsMetals
    keywordsThermal resistance
    keywordsFlow (Dynamics) AND Heat transfer coefficients
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian